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Satyanarayana V. Nitta, SV Nitta, Satya Nitta, satya v. nitta
Satyanarayana V. Nitta, SV Nitta, Satya Nitta, satya v. nitta
IBM, rensselaer polytechnic institute
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Multi component dielectric layer
SM Gates, A Grill, S Van Nguyen, SV Nitta
US Patent 8,357,608, 2013
4842013
METHOD OF PE-ALD OF SiNxCy AND INTEGRATION OF LINER MATERIALS ON POROUS LOW K SUBSTRATES
AJ Kellock, H Kim, DG Park, SV Nitta, S Purushothaman, S Rossnagel, ...
US Patent App. 12/203,338, 2010
4222010
Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics
N Chakrapani, ME Colburn, CD Dimitrakopoulos, D Pfeiffer, ...
US Patent 7,179,758, 2007
3422007
Method for air gap interconnect integration using photo-patternable low k material
LA Clevenger, M Darnon, Q Lin, AD Lisi, SV Nitta
US Patent 8,241,992, 2012
3242012
Electrical integrity of state-of-the-art 0.13/spl mu/m SOI CMOS devices and circuits transferred for three-dimensional (3D) integrated circuit (IC) fabrication
KW Guarini, AW Topol, M Ieong, R Yu, L Shi, MR Newport, DJ Frank, ...
Digest. International Electron Devices Meeting,, 943-945, 2002
2042002
Microelectronic structure including air gap
DC Edelstein, DV Horak, EE Huang, SV Nitta, T Nogami, S Ponoth, ...
US Patent 8,288,268, 2012
2022012
Closed air gap interconnect structure
KL Saenger, M Surendra, SV Nitta, S Purushothaman, ME Colburn, ...
US Patent 7,361,991, 2008
1772008
Closed air gap interconnect structure
KL Saenger, M Surendra, SV Nitta, S Purushothaman, ME Colburn, ...
US Patent 7,361,991, 2008
1772008
Closed air gap interconnect structure
KL Saenger, M Surendra, SV Nitta, S Purushothaman, ME Colburn, ...
US Patent 7,361,991, 2008
1772008
Surface modified spin-on xerogel films as interlayer dielectrics
SV Nitta, V Pisupatti, A Jain, PC Wayner Jr, WN Gill, JL Plawsky
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 1999
1771999
Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material
A Grill, JC Hedrick, CV Jahnes, SV Nitta, KS Petrarca, S Purushothaman, ...
US Patent 6,413,852, 2002
1632002
Robust ultra-low k interconnect structures using bridge-then-metallization fabrication sequence
ME Colburn, EE Huang, SV Nitta, S Purushothaman, KL Saenger
US Patent 6,930,034, 2005
1312005
Very low effective dielectric constant interconnect structures and methods for fabricating the same
DF Canaperi, TJ Dalton, SM Gates, M Krishnan, SV Nitta, ...
US Patent 7,045,453, 2006
1302006
Very low effective dielectric constant interconnect Structures and methods for fabricating the same
DF Canaperi, TJ Dalton, SM Gates, M Krishnan, SV Nitta, ...
US Patent 7,023,093, 2006
1272006
Multilevel interconnect structure containing air gaps and method for making
A Grill, JC Hedrick, CV Jahnes, SV Nitta, KS Petrarca, S Purushothaman, ...
US Patent 6,737,725, 2004
1182004
Method for forming a porous dielectric material layer in a semiconductor device and device formed
TJ Dalton, SE Greco, JC Hedrick, SV Nitta, S Purushothaman, KP Rodbell, ...
US Patent 6,451,712, 2002
992002
Interconnect structures with fully aligned vias
DC Edelstein, NC Fuller, EE Huang, SV Nitta, DL Rath
US Patent 9,324,650, 2016
972016
Ordered two-phase dielectric film, and semiconductor device containing the same
SM Gates, CB Murray, SV Nitta, S Purushothaman
US Patent 6,780,499, 2004
792004
Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same
ME Colburn, SM Gates, JC Hedrick, E Huang, SV Nitta, S Purushothaman, ...
US Patent 6,911,400, 2005
772005
Method for fabricating a self-aligned nanocolumnar airbridge and structure produced thereby
ME Colburn, SV Nitta, S Purushothaman
US Patent 7,037,744, 2006
732006
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