| The 2021 magnonics roadmap A Barman, G Gubbiotti, S Ladak, AO Adeyeye, M Krawczyk, J Gräfe, ... Journal of Physics: Condensed Matter 33 (41), 413001, 2021 | 475 | 2021 |
| Compact physical models for multiwall carbon-nanotube interconnects A Naeemi, JD Meindl IEEE Electron Device Letters 27 (5), 338-340, 2006 | 396 | 2006 |
| Performance comparison between carbon nanotube and copper interconnects for gigascale integration (GSI) A Naeemi, R Sarvari, JD Meindl IEEE Electron Device Letters 26 (2), 84-86, 2005 | 396 | 2005 |
| Conductance modeling for graphene nanoribbon (GNR) interconnects A Naeemi, JD Meindl IEEE electron device letters 28 (5), 428-431, 2007 | 312 | 2007 |
| Design and performance modeling for single-walled carbon nanotubes as local, semiglobal, and global interconnects in gigascale integrated systems A Naeemi, JD Meindl IEEE Transactions on Electron Devices 54 (1), 26-37, 2006 | 303 | 2006 |
| Compact physics-based circuit models for graphene nanoribbon interconnects A Naeemi, JD Meindl IEEE Transactions on Electron Devices 56 (9), 1822-1833, 2009 | 282 | 2009 |
| Physical modeling of temperature coefficient of resistance for single-and multi-wall carbon nanotube interconnects A Naeemi, JD Meindl IEEE Electron Device Letters 28 (2), 135-138, 2007 | 192 | 2007 |
| Performance modeling for single-and multiwall carbon nanotubes as signal and power interconnects in gigascale systems A Naeemi, JD Meindl IEEE transactions on electron devices 55 (10), 2574-2582, 2008 | 185 | 2008 |
| Carbon nanotube interconnects A Naeemi, JD Meindl Proceedings of the 2007 international symposium on Physical design, 77-84, 2007 | 174 | 2007 |
| Power delivery for 3D chip stacks: Physical modeling and design implication G Huang, M Bakir, A Naeemi, H Chen, JD Meindl 2007 IEEE Electrical Performance of Electronic Packaging, 205-208, 2007 | 154 | 2007 |
| Evaluation of the potential performance of graphene nanoribbons as on-chip interconnects S Rakheja, V Kumar, A Naeemi Proceedings of the IEEE 101 (7), 1740-1765, 2013 | 144 | 2013 |
| 3D heterogeneous integrated systems: Liquid cooling, power delivery, and implementation MS Bakir, C King, D Sekar, H Thacker, B Dang, G Huang, A Naeemi, ... 2008 IEEE Custom Integrated Circuits Conference, 663-670, 2008 | 136 | 2008 |
| Monolayer metallic nanotube interconnects: Promising candidates for short local interconnects A Naeemi, JD Meindl IEEE Electron Device Letters 26 (8), 544-546, 2005 | 112 | 2005 |
| Performance and energy-per-bit modeling of multilayer graphene nanoribbon conductors V Kumar, S Rakheja, A Naeemi IEEE transactions on electron devices 59 (10), 2753-2761, 2012 | 110 | 2012 |
| Cu interconnect limitations and opportunities for SWNT interconnects at the end of the roadmap A Ceyhan, A Naeemi IEEE Transactions on Electron Devices 60 (1), 374-382, 2012 | 105 | 2012 |
| Performance benchmarking for graphene nanoribbon, carbon nanotube, and Cu interconnects A Naeemi, JD Meindl 2008 International Interconnect Technology Conference, 183-185, 2008 | 105 | 2008 |
| Non-volatile clocked spin wave interconnect for beyond-CMOS nanomagnet pipelines S Dutta, SC Chang, N Kani, DE Nikonov, S Manipatruni, IA Young, ... Scientific reports 5 (1), 9861, 2015 | 86 | 2015 |
| Impact of electron-phonon scattering on the performance of carbon nanotube interconnects for GSI A Naeemi, JD Meindl IEEE Electron Device Letters 26 (7), 476-478, 2005 | 68 | 2005 |
| Optimal global interconnects for GSI A Naeemi, R Venkatesan, JD Meindl IEEE Transactions on Electron Devices 50 (4), 980-987, 2003 | 62 | 2003 |
| Interconnecting device opportunities for gigascale integration (GSI) JD Meindl, R Venkatesan, JA Davis, J Joyner, A Naeemi, P Zarkesh-Ha, ... International Electron Devices Meeting. Technical Digest (Cat. No. 01CH37224 …, 2001 | 58 | 2001 |
Chenyun PanAssistant Professor of EE, University of Texas at ArlingtonDirección de correo verificada de uta.edu
