| A double-end sourced wire-bonded multichip SiC MOSFET power module with improved dynamic current sharing M Wang, F Luo, L Xu IEEE Journal of Emerging and Selected Topics in Power Electronics 5 (4 …, 2017 | 71 | 2017 |
| Investigation and review of challenges in a high-temperature 30-kVA three-phase inverter using SiC MOSFETs F Qi, M Wang, L Xu IEEE Transactions on Industry Applications 54 (3), 2483-2491, 2018 | 32 | 2018 |
| Common-mode noise comparison study for lateral wire-bonded and vertically integrated power modules C Yao, W Li, H Li, C Han, M Wang, J Qian, X Zhang, F Luo, J Wang 2015 IEEE Energy Conversion Congress and Exposition (ECCE), 3092-3098, 2015 | 13 | 2015 |
| A double-end sourced multi-chip improved wire-bonded SiC MOSFET power module design M Wang, F Luo, L Xu 2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 709-714, 2016 | 12 | 2016 |
| Design and evaluation of 30kVA inverter using SiC MOSFET for 180° C ambient temperature operation F Qi, M Wang, L Xu, B Zhao, Z Zhou, X Ren 2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 2912-2918, 2016 | 11 | 2016 |
| An optimized gate-loop layout for multi-chip SiC MOSFET power modules M Wang, F Luo, L Xu 2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2015 | 6 | 2015 |
| Sensorless control of BLDC motor from zero to low speed based on rotor saliency Y Liu, M Wang, L Xu 2014 IEEE Conference and Expo Transportation Electrification Asia-Pacific …, 2014 | 6 | 2014 |
| Stepping Vector Control of BLDC Motor Y Liu, L Xu, M Wang, M Jin 2014 IEEE Conference and Expo Transportation Electrification Asia-Pacific …, 2014 | 3 | 2014 |
| Development of 30KVA inverter using SIC MOSFET for 180° C ambient temperature operation F Qi, M Wang, L Xu 2016 IEEE International Power Electronics and Motion Control Conference …, 2016 | 2 | 2016 |
| An improved wire-bonded power module with double-end sourced structure M Wang, F Luo, L Xu 2016 IEEE Energy Conversion Congress and Exposition (ECCE), 1-5, 2016 | 2 | 2016 |
| A high power-density three-phase inverter adopting the double-end sourced power module layout M Wang, F Luo, W Li, J Qian, L Xu 2016 International Symposium on 3D Power Electronics Integration and …, 2016 | 2 | 2016 |
| Design of A Double-End Sourced Multi-Chip Power Module and A High Power-Density Three-Phase Inverter M Wang The Ohio State University, 2016 | | 2016 |
