Crea el meu perfil
Coautors
- Naga BhushanVP of Technology, Qualcomm IncorporatedCorreu electrònic verificat a qti.qualcomm.com
- Alexandros ManolakosSenior Staff Systems Engineer, WR&D Qualcomm Inc. San Diego, CACorreu electrònic verificat a stanford.edu
- Wanshi ChenQualcomm Inc.Correu electrònic verificat a qti.qualcomm.com
- Behnaam AazhangJ.S. Abercrombie Professor in Electrical and Computer Engineering, Rice UniversityCorreu electrònic verificat a rice.edu
- Ashutosh SabharwalDepartment Chair and Ernest D. Butcher Professor, Department of Electrical and Computer EngineeringCorreu electrònic verificat a rice.edu
- Bojan VrceljXR Research @ QualcommCorreu electrònic verificat a qti.qualcomm.com
- Sundar Subramaniandirector of engineeringCorreu electrònic verificat a qti.qualcomm.com
- Muhammad Nazmul IslamQualcommCorreu electrònic verificat a qti.qualcomm.com
- Elza ErkipNew York UniversityCorreu electrònic verificat a nyu.edu
- Gabi SarkisQualcommCorreu electrònic verificat a mail.mcgill.ca
- Navid AbediniQualcomm, Texas A&M, Sharif UniversityCorreu electrònic verificat a qti.qualcomm.com
- Chih-Ping LiQualcomm Research, Qualcomm Technologies, Inc.Correu electrònic verificat a qti.qualcomm.com
- Jorma LillebergAdjunct Professor, ECE, Rice UniversityCorreu electrònic verificat a rice.edu
- Zhiyuan YanLehigh UniversityCorreu electrònic verificat a lehigh.edu
- Durga MalladiQualcomm Inc.Correu electrònic verificat a qti.qualcomm.com
- Xinmiao ZhangThe Ohio State UniversityCorreu electrònic verificat a case.edu
- An Mei ChenVP, Engineering, Qualcomm, Inc.Correu electrònic verificat a qualcomm.com
- Vasanthan RaghavanPrincipal Engineer, QualcommCorreu electrònic verificat a ieee.org