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Tim Tilford
Tim Tilford
Senior Lecturer, University of Greenwich
Dirección de correo verificada de gre.ac.uk
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Wire bond reliability for power electronic modules-effect of bonding temperature
WS Loh, M Corfield, H Lu, S Hogg, T Tilford, CM Johnson
2007 International Conference on Thermal, Mechanical and Multi-Physics …, 2007
732007
Lifetime prediction for power electronics module substrate mount-down solder interconnect
H Lu, T Tilford, DR Newcombe
High Density packaging and Microsystem Integration, 2007. HDP'07 …, 2007
672007
Microwave modeling and validation in food thawing applications
T Tilford, E Baginski, J Kelder, K Parrott, K Pericleous
Journal of Microwave Power and Electromagnetic Energy 41 (4), 30-45, 2006
382006
Design, manufacture and test for reliable 3D printed electronics packaging
T Tilford, S Stoyanov, J Braun, JC Janhsen, M Burgard, R Birch, C Bailey
Microelectronics Reliability 85, 109-117, 2018
362018
Reliability analysis for power electronics modules
C Bailey, T Tilford, H Lu
2007 30th International Spring Seminar on Electronics Technology (ISSE), 12-17, 2007
322007
Data driven approach to quality assessment of 3D printed electronic products
G Tourloukis, S Stoyanov, T Tilford, C Bailey
2015 38th International Spring Seminar on Electronics Technology (ISSE), 300-305, 2015
312015
Predicting the reliability of power electronic modules
C Bailey, H Lu, T Tilford
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International …, 2007
262007
Reliability of power electronic modules
H Lu, WS Loh, T Tilford, M Johnson, C Bailey
International Electronic Packaging Technical Conference and Exhibition 42789 …, 2007
202007
3D-printing and electronic packaging
C Bailey, S Stoyanov, T Tilford, G Tourloukis
2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-7, 2016
182016
Multiphysics simulation of microwave curing in micro‐electronics packaging applications
T Tilford, KI Sinclair, C Bailey, MPY Desmulliez, G Goussettis, AK Parrott, ...
Soldering & surface mount technology, 2007
182007
Analysis of sandstone pore space fluid saturation and mineralogy variation via application of monostatic K-band frequency modulated continuous wave radar
J Blanche, D Flynn, H Lewis, GD Couples, J Buckman, C Bailey, T Tilford
IEEE Access 6, 44376-44389, 2018
132018
3D-printing and electronic packaging-current status and future challenges
C Bailey, S Stoyanov, T Tilford, G Tourloukis
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 1-4, 2016
132016
Comparative reliability of inkjet-printed electronics packaging
T Tilford, S Stoyanov, J Braun, JC Janhsen, MK Patel, C Bailey
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021
122021
Polymer cure modeling for microelectronics applications
JE Morris, T Tilford, C Bailey, KI Sinclair, MPY Desmulliez
Electronics Technology, 2009. ISSE 2009. 32nd International Spring Seminar …, 2009
122009
Predictive modelling for 3D inkjet printing processes
G Tourloukis, S Stoyanov, T Tilford, C Bailey
2016 39th International Spring Seminar on Electronics Technology (ISSE), 257-262, 2016
112016
Encapsulation of microelectronic components using open-ended microwave oven
SK Pavuluri, M Ferenets, G Goussetis, MPY Desmulliez, T Tilford, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (5 …, 2012
112012
Optimization of an open-ended microwave oven for microelectronics packaging
KI Sinclair, G Goussetis, MPY Desmulliez, AJ Sangster, T Tilford, C Bailey, ...
IEEE transactions on microwave theory and techniques 56 (11), 2635-2641, 2008
112008
Predictive reliability and prognostics for electronic components: Current capabilities and future challenges
C Bailey, H Lu, S Stoyanov, C Yin, T Tilford, S Ridout
2008 31st International Spring Seminar on Electronics Technology, 67-72, 2008
112008
Multi-physics models and condition-based monitoring for 3d-printing of electronic packages
C Bailey, S Stoyanov, T Tilford, G Tourloukis
2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017
92017
Optimizing the reliability of power electronics module isolation substrates
C Bailey, T Tilford, S Ridout, H Lu
Proceedings of the 2008 International Conference on Engineering Optimization …, 2008
92008
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Artículos 1–20