Rabindra Das
Rabindra Das
Technical Staff, Advanced Technology Division, MIT Lincoln Lab
Verified email at ll.mit.edu
Title
Cited by
Cited by
Year
Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
RN Das, KI Papathomas, VR Markovich
US Patent 8,063,315, 2011
1232011
Random laser action in organic–inorganic nanocomposites
D Anglos, A Stassinopoulos, RN Das, G Zacharakis, M Psyllaki, ...
JOSA B 21 (1), 208-213, 2004
1222004
Low‐Temperature Preparation of Nanocrystalline Lead Zirconate Titanate and Lead Lanthanum Zirconate Titanate Powders Using Triethanolamine
RN Das, A Pathak, P Pramanik
Journal of the American Ceramic Society 81 (12), 3357-3360, 1998
1101998
Nanocrystalline α‐Al2O3 Using Sucrose
RN Das, A Bandyopadhyay, S Bose
Journal of the American Ceramic Society 84 (10), 2421-2423, 2001
1042001
Method of making a circuitized substrate having at least one capacitor therein
RN Das, FD Egitto, HT Lin, JM Lauffer, VR Markovich
US Patent App. 11/878,673, 2008
622008
Aminoazetidine,-pyrrolidine and-piperidine derivatives
FZ Dorwald, R Hohlweg
US Patent 6,673,829, 2004
56*2004
Nanocrystalline ceramics from sucrose process
RN Das
Materials Letters 47 (6), 344-350, 2001
532001
Solution sol–gel processing and investigation of percolation threshold in La2/3Ca1/3MnO3: xSiO2 nanocomposite
D Das, P Chowdhury, RN Das, CM Srivastava, AK Nigam, D Bahadur
Journal of Magnetism and Magnetic Materials 238 (2-3), 178-184, 2002
522002
Conductive metal micro-pillars for enhanced electrical interconnection
RN Das, KI Papathomas, MD Poliks, VR Markovich
US Patent App. 13/082,502, 2012
512012
Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
RN Das, KI Papathomas, VR Markovich
US Patent App. 13/252,256, 2012
512012
Chemical synthesis of fine powder of lead magnesium niobate using niobium tartarate complex
RN Das, P Pramanik
Materials Letters 46 (1), 7-14, 2000
502000
3D integrated superconducting qubits
D Rosenberg, D Kim, R Das, D Yost, S Gustavsson, D Hover, P Krantz, ...
npj quantum information 3 (1), 1-5, 2017
462017
Analysis and mitigation of interface losses in trenched superconducting coplanar waveguide resonators
G Calusine, A Melville, W Woods, R Das, C Stull, V Bolkhovsky, D Braje, ...
Applied Physics Letters 112 (6), 062601, 2018
332018
Random lasing from surface modified films of zinc oxide nanoparticles
A Stassinopoulos, RN Das, EP Giannelis, SH Anastasiadis, D Anglos
Applied surface science 247 (1-4), 18-24, 2005
332005
Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system …
RN Das, JM Lauffer, KI Papathomas, MD Poliks
US Patent 7,541,265, 2009
292009
Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information …
RN Das, JM Lauffer, VR Markovich, MD Poliks
US Patent 7,025,607, 2006
282006
Qubit and coupler circuit structures and coupling techniques
WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker
US Patent 10,134,972, 2018
27*2018
Nano‐and micro‐filled conducting adhesives for z‐axis interconnections: new direction for high‐speed, high‐density, organic microelectronics packaging
RN Das, FD Egitto, VR Markovich
Circuit World, 2008
272008
Multi-layer embedded capacitance and resistance substrate core
RN Das, JM Lauffer, I Memis, SG Rosser
US Patent 7,791,897, 2010
262010
Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same …
RN Das, JM Lauffer, RH Magnuson, VR Markovich
US Patent 7,442,879, 2008
262008
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Articles 1–20