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| Effect of nano-Fe2O3 additions on wettability and interfacial intermetallic growth of low-Ag content Sn–Ag–Cu solders on Cu substrates Y Gu, X Zhao, Y Li, Y Liu, Y Wang, Z Li Journal of Alloys and Compounds 627, 39-47, 2015 | 117 | 2015 |
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Sheng XuUniversity of California San DiegoDirección de correo verificada de ucsd.edu
