Inductively coupled pulsed plasmas in the presence of synchronous pulsed substrate bias for robust, reliable, and fine conductor etching S Banna, A Agarwal, K Tokashiki, H Cho, S Rauf, V Todorow, ... IEEE Transactions on Plasma Science 37 (9), 1730-1746, 2009 | 111 | 2009 |
Self-consistent simulation of very high frequency capacitively coupled plasmas S Rauf, K Bera, K Collins Plasma Sources Science and Technology 17 (3), 035003, 2008 | 90 | 2008 |
Self-consistent simulation of very high frequency capacitively coupled plasmas S Rauf, K Bera, K Collins Plasma Sources Science and Technology 17 (3), 035003, 2008 | 90 | 2008 |
Effect of simultaneous source and bias pulsing in inductively coupled plasma etching A Agarwal, PJ Stout, S Banna, S Rauf, K Tokashiki, JY Lee, K Collins Journal of Applied Physics 106 (10), 2009 | 67 | 2009 |
Self-consistent electrodynamics of large-area high-frequency capacitive plasma discharge Z Chen, S Rauf, K Collins Journal of Applied Physics 108 (7), 2010 | 58 | 2010 |
Effects of interelectrode gap on high frequency and very high frequency capacitively coupled plasmas K Bera, S Rauf, K Ramaswamy, K Collins Journal of Vacuum Science & Technology A 27 (4), 706-711, 2009 | 49 | 2009 |
Control of plasma uniformity in a capacitive discharge using two very high frequency power sources K Bera, S Rauf, K Ramaswamy, K Collins Journal of Applied Physics 106 (3), 2009 | 48 | 2009 |
Synchronous pulse plasma operation upon source and bias radio frequencys for inductively coupled plasma for highly reliable gate etching technology K Tokashiki, H Cho, S Banna, JY Lee, K Shin, V Todorow, WS Kim, ... Japanese journal of applied physics 48 (8S1), 08HD01, 2009 | 41 | 2009 |
Synchronous pulse plasma operation upon source and bias radio frequencys for inductively coupled plasma for highly reliable gate etching technology K Tokashiki, H Cho, S Banna, JY Lee, K Shin, V Todorow, WS Kim, ... Japanese journal of applied physics 48 (8S1), 08HD01, 2009 | 41 | 2009 |
Gas heating mechanisms in capacitively coupled plasmas A Agarwal, S Rauf, K Collins Plasma Sources Science and Technology 21 (5), 055012, 2012 | 40 | 2012 |
Extraction of negative ions from pulsed electronegative capacitively coupled plasmas A Agarwal, S Rauf, K Collins Journal of Applied Physics 112 (3), 2012 | 37 | 2012 |
Effect of resonance in external radio-frequency circuit on very high frequency plasma discharge S Rauf, Z Chen, K Collins Journal of Applied Physics 107 (9), 2010 | 37 | 2010 |
Power dynamics in a low pressure capacitively coupled plasma discharge S Rauf, K Bera, K Collins Plasma Sources Science and Technology 19 (1), 015014, 2009 | 36 | 2009 |
Three-dimensional model of magnetized capacitively coupled plasmas S Rauf, J Kenney, K Collins Journal of Applied Physics 105 (10), 2009 | 31 | 2009 |
Recouping etch rates in pulsed inductively coupled plasmas A Agarwal, PJ Stout, S Banna, S Rauf, K Collins Journal of Vacuum Science & Technology A 29 (1), 2011 | 27 | 2011 |
Influence of inhomogeneous magnetic field on the characteristics of very high frequency capacitively coupled plasmas K Bera, S Rauf, J Kenney, L Dorf, K Collins Journal of Applied Physics 107 (5), 2010 | 24 | 2010 |
Control of plasma uniformity using phase difference in a VHF plasma process chamber K Bera, S Rauf, K Collins IEEE transactions on plasma science 36 (4), 1366-1367, 2008 | 23 | 2008 |
Decreasing high ion energy during transition in pulsed inductively coupled plasmas A Agarwal, PJ Stout, S Banna, S Rauf, K Collins Applied Physics Letters 100 (4), 2012 | 18 | 2012 |
Impact of phase lag on uniformity in pulsed capacitively coupled plasmas A Agarwal, S Rauf, K Collins Applied Physics Letters 99 (2), 2011 | 16 | 2011 |
Effect of segmenting powered electrode on plasma uniformity in large-area capacitively coupled plasma discharge Z Chen, J Kenney, S Rauf, K Collins, T Tanaka, N Hammond, J Kudela IEEE Transactions on Plasma Science 39 (11), 2526-2527, 2011 | 12 | 2011 |