Qing (Ching) Zhang
Qing (Ching) Zhang
NXP Semiconductors (formerly Freescale Semiconductor)
Verified email at nxp.com - Homepage
Title
Cited by
Cited by
Year
Filter-based microfluidic device as a platform for immunofluorescent assay of microbial cells
L Zhu, Q Zhang, H Feng, S Ang, FS Chau, WT Liu
Lab on a Chip 4 (4), 337-341, 2004
1112004
Microfluidic device as a new platform for immunofluorescent detection of viruses
WT Liu, L Zhu, QW Qin, Q Zhang, H Feng, S Ang
Lab on a Chip 5 (11), 1327-1330, 2005
872005
Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures
Y Lin, H Cao, QZ Zhang, K Chen, J Fang
US Patent 7,691,747, 2010
692010
Microbial detection in microfluidic devices through dual staining of quantum dots-labeled immunoassay and RNA hybridization
Q Zhang, L Zhu, H Feng, S Ang, FS Chau, WT Liu
Analytica chimica acta 556 (1), 171-177, 2006
522006
Electrostatic actuator with liquid metal–elastomer compliant electrodes used for on-chip microvalving
N Pekas, Q Zhang, D Juncker
Journal of Micromechanics and Microengineering 22 (9), 097001, 2012
422012
Wet-etching of structures with straight facets and adjustable taper into glass substrates
N Pekas, Q Zhang, M Nannini, D Juncker
Lab on a Chip 10 (4), 494-498, 2010
342010
Semiconductor device and method of forming integrated passive device module
Y Lin, H Cao, Q Zhang, K Chen, J Fang
US Patent 7,790,503, 2010
312010
Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures
Y Lin, H Cao, Q Zhang, K Chen, J Fang
US Patent 8,310,058, 2012
302012
Surface-Micromachined CMUT Using Low-Temperature Deposited Silicon Carbide Membranes for Above-IC Integration
Q Zhang, PV Cicek, K Allidina, F Nabki, MNEG El-Gamal
Journal of Microelectromechanical Systems, 1-1, 2013
282013
Semiconductor device and method of forming passive devices
Y Lin, H Cao, Q Zhang, RC Frye
US Patent 8,124,490, 2012
252012
Semiconductor device and method of making integrated passive devices
Y Lin, H Cao, Q Zhang, K Chen, J Fang
US Patent 8,409,970, 2013
232013
Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate
Y Lin, H Cao, K Chen, Q Zhang, J Fang
US Patent 7,749,814, 2010
232010
Semiconductor device and method of protecting passivation layer in a solder bump process
Y Lin, H Cao, Q Zhang
US Patent 7,727,876, 2010
202010
Semiconductor device with solder bump formed on high topography plated Cu pads
Y Lin, Q Zhang, H Cao
US Patent 8,304,904, 2012
132012
Method of forming solder bump on high topography plated Cu
Y Lin, Q Zhang, H Cao
US Patent 7,682,959, 2010
112010
Method of forming an inductor on a semiconductor wafer
Y Lin, H Cao, Q Zhang
US Patent 8,309,452, 2012
82012
A novel prototyping method for die-level monolithic integration of MEMS above-IC
PV Cicek, Q Zhang, T Saha, S Mahdavi, K Allidina, F Nabki, M El Gamal
Journal of Micromechanics and Microengineering 23 (6), 065013, 2013
62013
Method of forming an inductor on a semiconductor wafer
Y Lin, H Cao, Q Zhang
US Patent 7,772,106, 2010
62010
Thin-film encapsulation technology for above-IC MEMS wafer-level packaging
Q Zhang, PV Cicek, F Nabki, M El-Gamal
Journal of Micromechanics and Microengineering 23 (12), 125012, 2013
52013
Microvalve system
N Pekas
US Patent 8,528,602, 2013
52013
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