Khai Ngo
Citado por
Citado por
Switching converter with pseudo-resonant DC link
US Patent 4,965,709, 1990
A 1200-V, 60-A SiC MOSFET multichip phase-leg module for high-temperature, high-frequency applications
Z Chen, Y Yao, D Boroyevich, KDT Ngo, P Mattavelli, K Rajashekara
IEEE Transactions on Power Electronics 29 (5), 2307-2320, 2013
Steady-state analysis and design of a switched-capacitor DC-DC converter
KDT Ngo, R Webster
23rd Annual IEEE Power Electronics Specialists Conference, 1992., 378 - 385 …, 1992
A 500kHz, 250W DC-DC converter with multiple outputs controlled by phase-shifted PWM and magnetic amplifiers
RA Fisher
HFPC Proc., 1988, 1988
A PWM method for reduction of switching loss in a full-bridge inverter
RS Lai, KDT Ngo
IEEE Transactions on Power Electronics 10 (3), 326-332, 1995
Acoustic energy harvesting using an electromechanical Helmholtz resonator
F Liu, A Phipps, S Horowitz, K Ngo, L Cattafesta, T Nishida, M Sheplak
The Journal of the Acoustical Society of America 123 (4), 1983-1990, 2008
Energy reclamation from a vibrating piezoceramic composite beam
A Kasyap, J Lim, D Johnson, S Horowitz, T Nishida, K Ngo, M Sheplak, ...
Proceedings of 9th International Congress on Sound and Vibration 9 (271), 36-43, 2002
Full-bridge lossless switching converter
RL Steigerwald, KDT Ngo
US Patent 4,864,479, 1989
New core loss measurement method for high-frequency magnetic materials
M Mu, Q Li, DJ Gilham, FC Lee, KDT Ngo
IEEE Transactions on Power Electronics 29 (8), 4374-4381, 2013
A high-temperature SiC three-phase AC-DC converter design for> 100/spl deg/C ambient temperature
R Wang, D Boroyevich, P Ning, Z Wang, F Wang, P Mattavelli, KDT Ngo, ...
IEEE Transactions on Power Electronics 28 (1), 555-572, 2012
Low noise, high frequency synchronous rectifier
KDT Ngo, RL Steigerwald, JP Walden, BJ Baliga, CS Korman, HR Chang
US Patent 4,903,189, 1990
Characterization of lead-free solder and sintered nano-silver die-attach layers using thermal impedance
X Cao, T Wang, KDT Ngo, GQ Lu
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (4 …, 2011
A novel active power decoupling single-phase PWM rectifier topology
W Qi, H Wang, X Tan, G Wang, KDT Ngo
2014 IEEE Applied Power Electronics Conference and Exposition-APEC 2014, 89-95, 2014
A novel high-temperature planar package for SiC multichip phase-leg power module
P Ning, TG Lei, F Wang, GQ Lu, KDT Ngo, K Rajashekara
IEEE Transactions on power Electronics 25 (8), 2059-2067, 2010
Behavioral modeling of the IGBT using the Hammerstein configuration
JT Hsu, KDT Ngo
IEEE transactions on Power Electronics 11 (6), 746-754, 1996
Low frequency pulsed resonant converter for energy harvesting
S Xu, KDT Ngo, T Nishida, GB Chung, A Sharma
IEEE Transactions on power electronics 22 (1), 63-68, 2007
SiC wirebond multichip phase-leg module packaging design and testing for harsh environment
P Ning, R Lai, D Huff, F Wang, KDT Ngo, VD Immanuel, KJ Karimi
IEEE Transactions on Power Electronics 25 (1), 16-23, 2009
A class of ceramic-based chip inductors for hybrid integration in power supplies
MH Lim, JD van Wyk, FC Lee, KDT Ngo
IEEE Transactions on Power Electronics 23 (3), 1556-1564, 2008
A Hammerstein-based dynamic model for hysteresis phenomenon
JT Hsu, KDT Ngo
IEEE Transactions on Power Electronics 12 (3), 406-413, 1997
Technology road map for high frequency integrated DC-DC converter
Q Li, M Lim, J Sun, A Ball, Y Ying, FC Lee, KDT Ngo
2010 Twenty-Fifth Annual IEEE Applied Power Electronics Conference and …, 2010
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