Dissolvable metals for transient electronics L Yin, H Cheng, S Mao, R Haasch, Y Liu, X Xie, SW Hwang, H Jain, ... Advanced Functional Materials 24 (5), 645-658, 2014 | 446 | 2014 |
In-plane deformation mechanics for highly stretchable electronics Y Su, X Ping, KJ Yu, JW Lee, JA Fan, B Wang, M Li, R Li, DV Harburg, ... Advanced Materials 29 (8), 2016 | 172 | 2016 |
Epidermal radio frequency electronics for wireless power transfer X Huang, Y Liu, GW Kong, JH Seo, Y Ma, KI Jang, JA Fan, S Mao, Q Chen, ... Microsystems & Nanoengineering 2, 16052, 2016 | 98 | 2016 |
Compression-induced deformation of individual metal–organic framework microcrystals Z Su, YR Miao, SM Mao, GH Zhang, S Dillon, JT Miller, KS Suslick Journal of the American Chemical Society 137 (5), 1750-1753, 2015 | 74 | 2015 |
Quantitative comparison of sink efficiency of Cu–Nb, Cu–V and Cu–Ni interfaces for point defects S Mao, S Shu, J Zhou, RS Averback, SJ Dillon Acta Materialia 82, 328-335, 2015 | 63 | 2015 |
Large-deformation and high-strength amorphous porous carbon nanospheres Weizhu Yang, Shimin Mao, Jia Yang, Tao Shang, Hongguang Song, James Mabon ... Scientific Reports 6, 24187, 2016 | 62 | 2016 |
Mechanical properties of molybdenum disulfide and the effect of doping: an in situ TEM study AA Tedstone, DJ Lewis, R Hao, SM Mao, P Bellon, RS Averback, ... ACS applied materials & interfaces 7 (37), 20829-20834, 2015 | 60 | 2015 |
Effect of irradiation damage on the shear strength of Cu–Nb interfaces S Mao, S Özerinç, WP King, RS Averback, SJ Dillon Scripta materialia 90, 29-32, 2014 | 26 | 2014 |
Probing buckling and post-buckling deformation of hollow amorphous carbon nanospheres: In-situ experiment and theoretical analysis W Yang, J Yang, Y Dong, S Mao, Z Gao, Z Yue, SJ Dillon, H Xu, B Xu Carbon 137, 411-418, 2018 | 18 | 2018 |
Shear strengths of FCC-FCC cube-on-cube interfaces Xuying Liu, Rui Hao, Shimin Mao, Shen J Dillon Scripta Materialia 130, 178-181, 2017 | 17 | 2017 |
The influence of Cu–Nb interfaces on local vacancy concentrations in Cu S Mao, S Dillon, RS Averback Scripta Materialia 69 (1), 21-24, 2013 | 15 | 2013 |
Measuring size dependent electrical properties from nanoneedle structures: Pt/ZnO Schottky diodes S Mao, T Shang, B Park, DD Anderson, SJ Dillon Applied Physics Letters 104 (15), 2014 | 9 | 2014 |
Transient Electronics: Dissolvable Metals for Transient Electronics (Adv. Funct. Mater. 5/2014) L Yin, H Cheng, S Mao, R Haasch, Y Liu, X Xie, SW Hwang, H Jain, ... Advanced Functional Materials 24 (5), 644-644, 2014 | 5 | 2014 |
Processing tool having a monitoring device S Mao, S Huang, A Goel, A Subramani, PA Kraus US Patent 10,763,143, 2020 | 4 | 2020 |
Grain Boundary Parting Limit during Dealloying. KW Noh, K Tai, S Mao, SJ Dillon Advanced Engineering Materials 17 (2), 2015 | 3 | 2015 |
直接硼氢化钠/双氧水燃料电池研究 毛示旻, 刘建国, 邹志刚, 周毅, 陈建伟, 王小奇, 顾军, 于涛 电影技术 32 (12), 827-831, 2008 | 2 | 2008 |
Processing tool having a monitoring device S Mao, S Huang, A Goel, A Subramani, PA Kraus US Patent 10,957,565, 2021 | 1 | 2021 |
Approximating the Metastable Defect Concentration in Supersaturated Materials: A Case Study of the SrTiO3/TiO2 System L Sun, S Mao, SJ Dillon Journal of the American Ceramic Society 95 (2), 788-792, 2012 | 1 | 2012 |
Resonant process monitor Y Pan, V Krithivasan, S Mao, K Chan, MD Willwerth, A Subramani, A Goel, ... US Patent 11,551,905, 2023 | | 2023 |
Measuring Interfacial Shear Strength of CuxNi-Nb Alloys S Mao, S Dillon Microscopy and Microanalysis 22 (S3), 1480-1481, 2016 | | 2016 |