| Analysis and characterization of thermal transport in GaN HEMTs on Diamond substrates D Altman, M Tyhach, J McClymonds, S Kim, S Graham, J Cho, K Goodson, ... Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 71 | 2014 |
| Modeling and analysis for thermal management in gallium oxide field-effect transistors C Yuan, Y Zhang, R Montgomery, S Kim, J Shi, A Mauze, T Itoh, JS Speck, ... Journal of Applied Physics 127 (15), 2020 | 55 | 2020 |
| S2-T3: Next generation gallium nitride HEMTs enabled by diamond substrates M Tyhach, D Altman, S Bernstein, R Korenstein, J Cho, KE Goodson, ... 2014 Lester Eastman Conference on High Performance Devices (LEC), 1-4, 2014 | 38 | 2014 |
| The effects of AlN and copper back side deposition on the performance of etched back GaN/Si HEMTs G Pavlidis, SH Kim, I Abid, M Zegaoui, F Medjdoub, S Graham IEEE Electron Device Letters 40 (7), 1060-1063, 2019 | 29 | 2019 |
| Thermal Transport across Metal/β-Ga2O3 Interfaces J Shi, C Yuan, HL Huang, J Johnson, C Chae, S Wang, R Hanus, S Kim, ... ACS Applied Materials & Interfaces 13 (24), 29083-29091, 2021 | 26 | 2021 |
| Thermal management strategies for gallium oxide vertical trench-fin MOSFETs RH Montgomery, Y Zhang, C Yuan, S Kim, J Shi, T Itoh, A Mauze, ... Journal of Applied Physics 129 (8), 2021 | 26 | 2021 |
| Diamond-incorporated flip-chip integration for thermal management of GaN and ultra-wide bandgap RF power amplifiers D Shoemaker, M Malakoutian, B Chatterjee, Y Song, S Kim, BM Foley, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 25 | 2021 |
| Guidelines for reduced-order thermal modeling of multifinger GaN HEMTs R Pearson, B Chatterjee, S Kim, S Graham, A Rattner, S Choi Journal of Electronic Packaging 142 (2), 021012, 2020 | 17 | 2020 |
| Thermal Management of β-Ga₂O₃ Current Aperture Vertical Electron Transistors S Kim, Y Zhang, C Yuan, R Montgomery, A Mauze, J Shi, E Farzana, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 15 | 2021 |
| Thermal and thermomechanical modeling to design a gallium oxide power electronics package P Paret, G Moreno, B Kekelia, R Kotecha, X Feng, K Bennion, B Mather, ... 2018 IEEE 6th workshop on wide bandgap power devices and applications (WiPDA …, 2018 | 15 | 2018 |
| Effect of meniscus damping ratio on drop-on-demand electrohydrodynamic jetting SH Kim, H Kang, K Kang, SH Lee, KH Cho, JY Hwang Applied Sciences 8 (2), 164, 2018 | 15 | 2018 |
| Dropwise gelation-dehydration kinetics during drop-on-demand printing of hydrogel-based materials B Han, GY Yun, JW Boley, SH Kim, JY Hwang, GTC Chiu, K Park International journal of heat and mass transfer 97, 15-25, 2016 | 15 | 2016 |
| Thermally-Aware Layout Design of β-Ga₂O₃ Lateral MOSFETs SH Kim, D Shoemaker, B Chatterjee, AJ Green, KD Chabak, ER Heller, ... IEEE Transactions on Electron Devices 69 (3), 1251-1257, 2022 | 12 | 2022 |
| Water-matrix interaction at the drop-drop interface during drop-on-demand printing of hydrogels BH C Cheng, YJ Moon, SH Kim, YC Jeong, JY Hwang, GTC Chiu International Journal of Heat and Mass Transfer 150 (119327), 2020 | 7 | 2020 |
| Transient Thermal Management of a β-Ga₂O₃ MOSFET Using a Double-Side Diamond Cooling Approach SH Kim, D Shoemaker, AJ Green, KD Chabak, KJ Liddy, S Graham, ... IEEE Transactions on Electron Devices 70 (4), 1628-1635, 2023 | 6 | 2023 |
| Thermal science and engineering of β-Ga2O3 materials and devices Z Cheng, J Shi, C Yuan, S Kim, S Graham Semiconductors and Semimetals 107, 77-99, 2021 | 6 | 2021 |
| Electrothermal modeling and analysis of gallium oxide power switching devices RM Kotecha, A Zakutayev, WK Metzger, P Paret, G Moreno, B Kekelia, ... International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 4 | 2019 |
| Ga2O3 packaging and thermal management challenges and opportunities G Moreno, KS Bennion, B Kekelia, RM Kotecha, BA Mather, ... National Renewable Energy Lab.(NREL), Golden, CO (United States), 2019 | 2 | 2019 |
| Device-level Transient Cooling of β-Ga2O3 MOSFETs SH Kim, JS Lundh, D Shoemaker, B Chatterjee, KD Chabak, AJ Green, ... 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 1 | 2022 |
| The effectiveness of heat extraction by the drain metal contact of β-Ga2O3 MOSFETs SH Kim, D Shoemaker, B Chatterjee, KD Chabak, AJ Green, KJ Liddy, ... 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2021 | 1 | 2021 |
