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Co-authors
Baopu LIthe Chinese University of Hong KongVerified email at ee.cuhk.edu.hk
Shuang SONGHarbin Institutes of Technology, ShenzhenVerified email at hit.edu.cn
Simon X. YangUniversity of GuelphVerified email at uoguelph.ca
Hongliang RenChinese University of Hong Kong / National University of SingaporeVerified email at jhu.edu
Peter X. LiuCarleton UniversityVerified email at sce.carleton.ca
Lisheng XUProfessor of Biomedical Engineering, Northeastern UniversityVerified email at bmie.neu.edu.cn
Yixuan YuanAssistant Professor in City University of Hong KongVerified email at cityu.edu.hk
Chaoqun WangThe Chinese University of HongKongVerified email at ee.cuhk.edu.hk
Ming LiuAssociate Prof, RAM-LAB, IADC, ECE, Hong Kong University of Science and TechnologyVerified email at ust.hk
Mrinal MandalProfessor of Electrical and Computer Engineering, University of AlbertaVerified email at ualberta.ca
Yuxiang SunHong Kong University of Science and TechnologyVerified email at ust.hk
Lujia WangShenzhen Institutes of Advanced Technology,Chinese Academy of SciencesVerified email at ee.cuhk.edu.hk
Xiao JiaThe Chinese University of Hong KongVerified email at ee.cuhk.edu.hk
Li MaoThe University of QueenslandVerified email at uq.edu.au
Wu-Sheng LuProfessor of Electrical Engineering, University of Victoria, CanadaVerified email at ece.uvic.ca
Qian ZhaoVerified email at jhu.edu
Lingfei Wu (吴凌飞)IBM T. J. Watson Research CenterVerified email at email.wm.edu
Kun LiApplied Scientist, AmazonVerified email at amazon.com
Roland SiegwartProfessor of Robotics, ETH Zurich, SwitzerlandVerified email at ethz.ch
Chris MacnabAssociate Professor, Electrical and Computer Engineering, University of CalgaryVerified email at ucalgary.ca