| Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections JW Xian, SA Belyakov, M Ollivier, K Nogita, H Yasuda, CM Gourlay Acta Materialia 126, 540-551, 2017 | 94 | 2017 |
| Effects of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5 Cu solders ZL Ma, SA Belyakov, CM Gourlay Journal of Alloys and Compounds 682, 326-337, 2016 | 84 | 2016 |
| Nucleation of tin on the Cu6Sn5 layer in electronic interconnections JW Xian, ZL Ma, SA Belyakov, M Ollivier, CM Gourlay Acta Materialia 123, 404-415, 2017 | 71 | 2017 |
| Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn JW Xian, G Zeng, SA Belyakov, Q Gu, K Nogita, CM Gourlay Intermetallics 91, 50-64, 2017 | 68 | 2017 |
| Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections ZL Ma, SA Belyakov, K Sweatman, T Nishimura, T Nishimura, CM Gourlay Nature Communications 8 (1), 1916, 2017 | 66 | 2017 |
| Nucleation and growth of tin in Pb-free solder joints CM Gourlay, SA Belyakov, ZL Ma, JW Xian Jom 67, 2383-2393, 2015 | 62 | 2015 |
| Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process MAA Mohd Salleh, SD McDonald, CM Gourlay, SA Belyakov, H Yasuda, ... Journal of Electronic Materials 45, 154-163, 2016 | 58 | 2016 |
| Heterogeneous nucleation of Cu6Sn5 in Sn–Cu–Al solders JW Xian, SA Belyakov, TB Britton, CM Gourlay Journal of Alloys and Compounds 619, 345-355, 2015 | 58 | 2015 |
| Heterogeneous nucleation of βSn on NiSn4, PdSn4 and PtSn4 SA Belyakov, CM Gourlay Acta materialia 71, 56-68, 2014 | 56 | 2014 |
| NiSn4 formation during the solidification of Sn–Ni alloys S Belyakov, C Gourlay Intermetallics 25, 48-59, 2012 | 55 | 2012 |
| In situ imaging of microstructure formation in electronic interconnections MAAM Salleh, CM Gourlay, JW Xian, SA Belyakov, H Yasuda, ... Scientific reports 7 (1), 40010, 2017 | 52 | 2017 |
| Influence of bismuth on the solidification of Sn-0.7 Cu-0.05 Ni-xBi/Cu joints SA Belyakov, JW Xian, K Sweatman, T Nishimura, T Akaiwa, CM Gourlay Journal of Alloys and Compounds 701, 321-334, 2017 | 51 | 2017 |
| Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds ZL Ma, JW Xian, SA Belyakov, CM Gourlay Acta Materialia 150, 281-294, 2018 | 45 | 2018 |
| AlSi2Sc2 intermetallic formation in Al-7Si-0.3 Mg-xSc alloys and their effects on as-cast properties P Pandee, CM Gourlay, SA Belyakov, U Patakham, G Zeng, ... Journal of Alloys and Compounds 731, 1159-1170, 2018 | 42 | 2018 |
| Eutectic morphology of Al-7Si-0.3 Mg alloys with scandium additions P Pandee, CM Gourlay, SA Belyakov, R Ozaki, H Yasuda, ... Metallurgical and Materials Transactions A 45, 4549-4560, 2014 | 38 | 2014 |
| Grain refinement of electronic solders: The potential of combining solute with nucleant particles H Shang, ZL Ma, SA Belyakov, CM Gourlay Journal of alloys and compounds 715, 471-485, 2017 | 35 | 2017 |
| Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7 Cu-0.05 Ni JW Xian, MAAM Salleh, SA Belyakov, TC Su, G Zeng, K Nogita, H Yasuda, ... Intermetallics 102, 34-45, 2018 | 33 | 2018 |
| Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints SA Belyakov, J Xian, G Zeng, K Sweatman, T Nishimura, T Akaiwa, ... Journal of Materials Science: Materials in Electronics 30, 378-390, 2019 | 28 | 2019 |
| NiSn4 Formation in As-Soldered Ni-Sn and ENIG-Sn Couples SA Belyakov, CM Gourlay Journal of electronic materials 41, 3331-3341, 2012 | 26 | 2012 |
| Controlling Bulk Cu6Sn5 Nucleation in Sn0.7Cu/Cu Joints with Al Micro-alloying JW Xian, SA Belyakov, CM Gourlay Journal of Electronic Materials 45, 69-78, 2016 | 25 | 2016 |
Christopher M. GourlayDepartment of Materials, Imperial College LondonDirección de correo verificada de imperial.ac.uk
