|A fast loss and temperature simulation method for power converters, Part I: Electrothermal modeling and validation|
A Bryant, NA Parker-Allotey, D Hamilton, I Swan, PA Mawby, T Ueta, ...
IEEE transactions on power electronics 27 (1), 248-257, 2011
|The impact of parasitic inductance on the performance of silicon–carbide Schottky barrier diodes|
O Alatise, NA Parker-Allotey, D Hamilton, P Mawby
IEEE Transactions on Power Electronics 27 (8), 3826-3833, 2012
|Heteroepitaxial Beta-Ga2O3 on 4H-SiC for an FET With Reduced Self Heating|
SAO Russell, A Pérez-Tomás, CF McConville, CA Fisher, DP Hamilton, ...
IEEE Journal of the Electron Devices Society 5 (4), 256-261, 2017
|Design, development and thermal analysis of reusable Li-ion battery module for future mobile and stationary applications|
AM Divakaran, D Hamilton, KN Manjunatha, M Minakshi
Energies 13 (6), 1477, 2020
|High-temperature electrical and thermal aging performance and application considerations for SiC power DMOSFETs|
DP Hamilton, MR Jennings, A Pérez-Tomás, SAO Russell, SA Hindmarsh, ...
IEEE Transactions on Power Electronics 32 (10), 7967-7979, 2016
|High temperature thermal cycling performance of DBA, AMB and thick film power module substrates|
DP Hamilton, S Riches, M Meisser, L Mills, P Mawby
CIPS 2016; 9th International Conference on Integrated Power Electronics …, 2016
|On the Ti3SiC2 metallic phase formation for robust p-type 4H-SiC ohmic contacts|
MR Jennings, CA Fisher, D Walker, A Sanchez, A Pérez-Tomás, ...
Materials Science Forum 778, 693-696, 2014
|Highly integrated power modules based on copper thick-film-on-DCB for high frequency operation of SiC semiconductors—Design and manufacture|
M Schmenger, M Meisser, D Hamilton, B Leyrer, M Bernd, P Mawby, ...
2015 17th European Conference on Power Electronics and Applications (EPE'15 …, 2015
|Low-inductive compact SiC power modules for high-frequency operation|
M Meisser, D Hamilton, T Blank, P Mawby
PCIM Europe 2014; International Exhibition and Conference for Power …, 2014
|High-temperature (1200–1400° C) dry oxidation of 3C-SiC on silicon|
YK Sharma, F Li, MR Jennings, CA Fisher, A Pérez-Tomás, S Thomas, ...
Journal of Electronic Materials 44 (11), 4167-4174, 2015
|Improved performance of 4H-SiC PiN diodes using a novel combined high temperature oxidation and annealing process|
CA Fisher, MR Jennings, YK Sharma, DP Hamilton, PM Gammon, ...
IEEE Transactions on Semiconductor Manufacturing 27 (3), 443-451, 2014
|Modelling and sensitivity analysis of isolated microgrids|
AM Abd-el-Motaleb, D Hamilton
Renewable and Sustainable Energy Reviews 47, 416-426, 2015
|DCB-based low-inductive SiC modules for high frequency operation|
M Meisser, D Hamilton, P Mawby
CIPS 2014; 8th International Conference on Integrated Power Electronics …, 2014
|Connector-less SiC power modules with integrated shunt—Low-profile design for low inductance and low cost|
M Meisser, H Demattio, D Hamilton, T Blank
2016 18th European Conference on Power Electronics and Applications (EPE'16 …, 2016
|Cryogenic characterization of commercial SiC power MOSFETs|
H Chen, PM Gammon, VA Shah, CA Fisher, CW Chan, S Jahdi, ...
Materials Science Forum 821, 777-780, 2015
|Conduction and switching loss comparison between an IGBT/Si-PiN diode pair and an IGBT/SiC-Schottky diode pair|
NA Parker-Allotey, O Alatise, D Hamilton, M Jennings, P Mawby, R Nash, ...
2011 2nd IEEE PES International Conference and Exhibition on Innovative …, 2011
|Evaluation of commercially available SiC devices and packaging materials for operation up to 350 C|
D Hamilton, M Jennings, Y Sharma, C Fisher, O Alatise, P Mawby
2014 IEEE Energy Conversion Congress and Exposition (ECCE), 4381-4387, 2014
|Validation of a fast loss and temperature simulation method for power converters|
AT Bryant, NA Parker-Allotey, IR Swan, DP Hamilton, PA Mawby, T Ueta, ...
2010 6th International Conference on Integrated Power Electronics Systems, 1-6, 2010
|A first evaluation of thick oxide 3C-SiC MOS capacitors reliability|
F Li, Q Song, A Perez-Tomas, V Shah, Y Sharma, D Hamilton, C Fisher, ...
IEEE Transactions on Electron Devices 67 (1), 237-242, 2019
|High temperature reliability of power module substrates|
D Hamilton, L Mills, J Bowen, M Jennings, P Mawby
Proceedings of PCIM Europe 2015; International Exhibition and Conference for …, 2015