Manifold: A parallel simulation framework for multicore systems J Wang, J Beu, R Bheda, T Conte, Z Dong, C Kersey, M Rasquinha, ... 2014 IEEE International Symposium on Performance Analysis of Systems and …, 2014 | 75 | 2014 |
Co-design of multicore architectures and microfluidic cooling for 3D stacked ICs Z Wan, H Xiao, Y Joshi, S Yalamanchili Microelectronics Journal 45 (12), 1814-1821, 2014 | 37 | 2014 |
CoolPIM: Thermal-aware source throttling for efficient PIM instruction offloading L Nai, R Hadidi, H Xiao, H Kim, J Sim, H Kim 2018 IEEE International Parallel and Distributed Processing Symposium (IPDPS …, 2018 | 23 | 2018 |
Throughput regulation in shared memory multicore processors X Chen, H Xiao, Y Wardi, S Yalamanchili 2015 IEEE 22nd International Conference on High Performance Computing (HiPC …, 2015 | 11 | 2015 |
Active fluidic cooling on energy constrained system-on-chip systems W Yueh, Z Wan, H Xiao, S Yalamanchili, Y Joshi, S Mukhopadhyay IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017 | 9 | 2017 |
Leakage power characterization and minimization in 3D stacked multi-core chips with microfluidic cooling H Xiao, Z Wan, S Yalamanchili, Y Joshi 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM …, 2014 | 9 | 2014 |
Thermal-aware processing-in-memory instruction offloading L Nai, R Hadidi, H Xiao, H Kim, J Sim, H Kim Journal of Parallel and Distributed Computing 130, 193-207, 2019 | 6 | 2019 |
Thermally adaptive cache access mechanisms for 3D many-core architectures H Xiao, W Yueh, S Mukhopadhyay, S Yalamanchili IEEE Computer Architecture Letters 15 (2), 129-132, 2015 | 3 | 2015 |
Thermal simulations in support of multi-scale co-design of energy efficient information technology systems Y Joshi, B Barabadi, R Ghosh, Z Wan, H Xiao, S Yalamanchili, S Kumar International Journal of Numerical Methods for Heat & Fluid Flow 25 (6 …, 2015 | 3 | 2015 |
Multi-Physics Driven Co-Design of 3D Multicore Architectures H Xiao, W Yueh, S Mukhopadhyay, S Yalamanchili International Electronic Packaging Technical Conference and Exhibition 56888 …, 2015 | 3 | 2015 |
VDPred: Predicting Voltage Droop for Power-Effient 3D Multi-core Processor Design H Xiao, M Kar, S Mukhopadhyay, S Yalamanchili 2021 13th International Conference on Computer and Automation Engineering …, 2021 | 1 | 2021 |
S3-P9: Thermal and electrical performance of microfluidically cooled 3D ICs with non-uniform power dissipation Z Wan, H Xiao, Y Joshi, S Yalamanchili 2014 Lester Eastman Conference on High Performance Devices (LEC), 1-4, 2014 | 1 | 2014 |
A multi-physics approach to the co-design of 3D multi-core processors H Xiao Georgia Institute of Technology, 2018 | | 2018 |
On-line Optimization of Power Efficiency in 3D Multicore Processors X Chen, H Xiao, Y Wardi, S Yalamanchili IFAC-PapersOnLine 51 (7), 127-132, 2018 | | 2018 |
Performance and Power Regulation in Multicore Processors X Chen, H Xiao, W Song, Y Wardi, S Yalamanchili | | |