TAPE: Thermal-aware agent-based power economy for multi/many-core architectures T Ebi, MA Al Faruque, J Henkel Proceedings of the 2009 International Conference on Computer-Aided Design …, 2009 | 168 | 2009 |
Towards interdependencies of aging mechanisms H Amrouch, VM van Santen, T Ebi, V Wenzel, J Henkel 2014 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 478-485, 2014 | 96 | 2014 |
Economic learning for thermal-aware power budgeting in many-core architectures T Ebi, D Kramer, W Karl, J Henkel Proceedings of the seventh IEEE/ACM/IFIP international conference on …, 2011 | 69 | 2011 |
Configurable links for runtime adaptive on-chip communication MA Al Faruque, T Ebi, J Henkel 2009 Design, Automation & Test in Europe Conference & Exhibition, 256-261, 2009 | 63 | 2009 |
Run-time adaptive on-chip communication scheme MA Al Faruque, T Ebi, J Henkel 2007 IEEE/ACM International Conference on Computer-Aided Design, 26-31, 2007 | 57 | 2007 |
Runtime thermal management using software agents for multi-and many-core architectures M Al Faruque, J Jahn, T Ebi, J Henkel IEEE Design & Test of Computers 27 (6), 58-68, 2010 | 54 | 2010 |
AdNoC: Runtime adaptive network-on-chip architecture MA Al Faruque, T Ebi, J Henkel IEEE Transactions on Very Large Scale Integration (VLSI) Systems 20 (2), 257-269, 2010 | 42 | 2010 |
ROAdNoC: Runtime observability for an adaptive network on chip architecture MA Al Faruque, T Ebi, J Henkel 2008 IEEE/ACM International Conference on Computer-Aided Design, 543-548, 2008 | 42 | 2008 |
Stress balancing to mitigate NBTI effects in register files H Amrouch, T Ebi, J Henkel 2013 43rd Annual IEEE/IFIP international conference on Dependable Systems …, 2013 | 38 | 2013 |
mDTM: Multi-objective dynamic thermal management for on-chip systems H Khdr, T Ebi, M Shafique, H Amrouch, JH Karlsruhe 2014 Design, Automation & Test in Europe Conference & Exhibition (DATE), 1-6, 2014 | 36 | 2014 |
Thermal management for dependable on-chip systems J Henkel, T Ebi, H Amrouch, H Khdr 2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC), 113-118, 2013 | 32 | 2013 |
Agent-based thermal management using real-time I/O communication relocation for 3D many-cores T Ebi, H Rauchfuss, A Herkersdorf, J Henkel Integrated Circuit and System Design. Power and Timing Modeling …, 2011 | 24 | 2011 |
Analyzing the thermal hotspots in FPGA-based embedded systems H Amrouch, T Ebi, J Schneider, S Parameswaran, J Henkel 2013 23rd International Conference on Field programmable Logic and …, 2013 | 20 | 2013 |
Cool: Control-based optimization of load-balancing for thermal behavior T Ebi, H Amrouch, J Henkel Proceedings of the eighth IEEE/ACM/IFIP international conference on Hardware …, 2012 | 20 | 2012 |
Accurate thermal-profile estimation and validation for fpga-mapped circuits A Amouri, H Amrouch, T Ebi, J Henkel, M Tahoori 2013 IEEE 21st Annual International Symposium on Field-Programmable Custom …, 2013 | 16 | 2013 |
Formal verification of distributed dynamic thermal management M Ismail, O Hasan, T Ebi, M Shafique, J Henkel 2013 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 248-255, 2013 | 15 | 2013 |
RESI: Register-embedded self-immunity for reliability enhancement H Amrouch, T Ebi, J Henkel IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2014 | 7 | 2014 |
Dodorg—a self-adaptive organic many-core architecture T Ebi, D Kramer, C Schuck, A von Renteln, J Becker, U Brinkschulte, ... Organic Computing—A Paradigm Shift for Complex Systems, 353-368, 2011 | 7 | 2011 |
NeuroNoC: Neural network inspired runtime adaptation for an on-chip communication architecture T Ebi, MA Al Faruque, J Henkel Proceedings of the eighth IEEE/ACM/IFIP international conference on Hardware …, 2010 | 4 | 2010 |
Thermal management for dependable on-chip systems T Ebi Karlsruhe, Karlsruher Institut für Technologie (KIT), Diss., 2014, 2014 | 2 | 2014 |