| Process for barrier coating of plastic objects JL Williams, SL Burkett, S McGuire US Patent 5,616,369, 1997 | 110 | 1997 |
| Process for barrier coating of plastic objects JL Williams, SL Burkett, S McGuire US Patent 5,364,666, 1994 | 109 | 1994 |
| A novel damage index for damage identification using guided waves with application in laminated composites S Torkamani, S Roy, ME Barkey, E Sazonov, S Burkett, S Kotru Smart Materials and Structures 23 (9), 095015, 2014 | 106 | 2014 |
| Architectural implications and process development of 3-D VLSI Z-axis interconnects using through silicon vias LW Schaper, SL Burkett, S Spiesshoefer, GV Vangara, Z Rahman, ... IEEE Transactions on Advanced Packaging 28 (3), 356-366, 2005 | 102 | 2005 |
| Process integration for through-silicon vias S Spiesshoefer, Z Rahman, G Vangara, S Polamreddy, S Burkett, ... Journal of Vacuum Science & Technology A 23 (4), 824-829, 2005 | 100 | 2005 |
| Process for barrier coating of plastic objects JL Williams, SL Burkett, S McGuire US Patent 5,468,520, 1995 | 92 | 1995 |
| Blood collection tube assembly NG Harvey, YG Tropsha, SL Burkett, RP Clarke, BS Wong US Patent 5,968,620, 1999 | 90 | 1999 |
| Polymer thickness effects on Bosch etch profiles CJD Craigie, T Sheehan, VN Johnson, SL Burkett, AJ Moll, WB Knowlton Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2002 | 80 | 2002 |
| Integrated system development for 3-D VLSI L Schaper, S Burkett, M Gordon, L Cai, Y Liu, G Jampana, IU Abhulimen 2007 Proceedings 57th Electronic Components and Technology Conference, 853-857, 2007 | 69 | 2007 |
| Temperature and field dependence of high-frequency magnetic noise in spin valve devices N Stutzke, SL Burkett, SE Russek Applied physics letters 82 (1), 91-93, 2003 | 64 | 2003 |
| Blood collection tube assembly YG Tropsha, CJ Knors, SL Burkett, BS Wong US Patent 5,919,328, 1999 | 64 | 1999 |
| Method to reduce gas transmission JL Williams, SL Burkett, S McGuire US Patent 5,510,155, 1996 | 63 | 1996 |
| Control of sidewall slope in silicon vias using plasma etching in a conventional reactive ion etching tool RF Figueroa, S Spiesshoefer, SL Burkett, L Schaper Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2005 | 62 | 2005 |
| Fabrication and electrical performance of through silicon via interconnects filled with a copper/carbon nanotube composite Y Feng, SL Burkett Journal of Vacuum Science & Technology B 33 (2), 2015 | 58 | 2015 |
| Blood collection tube assembly YG Tropsha, CJ Knors, SL Burkett, BS Wong US Patent 5,763,033, 1998 | 57 | 1998 |
| Modeling a copper/carbon nanotube composite for applications in electronic packaging Y Feng, SL Burkett Computational Materials Science 97, 1-5, 2015 | 53 | 2015 |
| Reliability study of through-silicon via (TSV) copper filled interconnects A Kamto, Y Liu, L Schaper, SL Burkett Thin Solid Films 518 (5), 1614-1619, 2009 | 52 | 2009 |
| Advanced processing techniques for through-wafer interconnects SL Burkett, X Qiao, D Temple, B Stoner, G McGuire Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2004 | 50 | 2004 |
| Blood collection tube assembly NG Harvey, YG Trophsa, SL Burkett, RP Clarke, BS Wong US Patent 5,716,683, 1998 | 49 | 1998 |
| Blood collection tube assembly NG Harvey, YG Trophsa, SL Burkett US Patent 5,686,157, 1997 | 47 | 1997 |
Ziaur RahmanGraduate Student, University of AlbertaVerified email at ualberta.ca
