| Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same JS Guzek, RK Nalla, JS Gonzalez, D Delaney, S Pothukuchi, M Mamodia, ... US Patent 8,786,066, 2014 | 57 | 2014 |
| Effect of microdomain structure and process conditions on the mechanical behavior of cylindrical block copolymer systems M Mamodia, A Panday, SP Gido, AJ Lesser Macromolecules 40 (20), 7320-7328, 2007 | 23 | 2007 |
| Forming die backside coating structures with coreless packages RN Manepalli, M Mamodia, D Xu, JS Gonzalez, ER Prack US Patent 8,466,559, 2013 | 18 | 2013 |
| Hierarchical description of deformation in block copolymer tpes M Mamodia, K Indukuri, ET Atkins, WH De Jeu, AJ Lesser Journal of materials science 43, 7035-7046, 2008 | 18 | 2008 |
| Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die D Xu, LR Arana, NR Raravikar, M Mamodia, R Swaminathan, R Manepalli US Patent 8,287,996, 2012 | 13 | 2012 |
| Polymeric compositions, methods of manufacture thereof and articles comprising the same AJ Lesser, NK Singh, M Mamodia US Patent 8,227,551, 2012 | 5 | 2012 |
| Integrated circuit packages with patterned protective material K Yazzie, NS Yagnamurthy, P Malatkar, CP Chiu, M Mamodia, MJ Gallina, ... US Patent 10,957,656, 2021 | 4 | 2021 |
| Bicontinuous porous ceramic composite for semiconductor package applications T Gaines, M Mamodia, P Start, K Hackenberg US Patent App. 15/859,483, 2019 | 3 | 2019 |
| Stiffener tape for electronic assembly X Brun, A Krishnan, M Mamodia, D Xu US Patent 9,793,151, 2017 | 2 | 2017 |
| Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same L Arana, D Xu, V Wakharkar, W Feng, N Chakrapani, ... US Patent 8,304,065, 2012 | 2 | 2012 |
| Probe pins with etched tips for electrical die test JD Stanford, D Craig, TP Albertson, M Mamodia, D Xu US Patent 10,598,696, 2020 | 1 | 2020 |
| Thermal head with a thermal barrier for integrated circuit die processing M Mamodia, K Yazzie, D Xu, K Liu, PJ Diglio, P Malatkar US Patent 10,499,461, 2019 | 1 | 2019 |
| Coating for a microelectronic device, treatment comprising same, and method of managing a thermal profile of a microelectronic die D Xu, LR Arana, NR Raravikar, M Mamodia, R Swaminathan, R Manepalli US Patent 8,569,108, 2013 | 1 | 2013 |
| EFFECT OF PROCESS CONDITIONS ON THE MICRO-DOMAIN STRUCTURE AND MECHANICAL BEHAVIOR OF CYLINDRICAL BLOCK COPOLYMER SYSTEMS M Mamodia, A Lesser ANTEC-CONFERENCE PROCEEDINGS- 3, 1772, 2007 | 1 | 2007 |
| Probe pins with etched tips for electrical die test JD Stanford, D Craig, TP Albertson, M Mamodia, D Xu US Patent 11,340,258, 2022 | | 2022 |
| Package with cathodic protection for corrosion mitigation K Yazzie, M Mamodia US Patent 10,998,275, 2021 | | 2021 |
| Structures to mitigate contamination on a back side of a semiconductor substrate XF Brun, S Agrawal, H Wu, M Mamodia, SE Ou, H Shi US Patent 9,698,108, 2017 | | 2017 |
| Adhesive with tunable adhesion for handling ultra-thin wafer NR Raravikar, M Mamodia US Patent App. 14/941,585, 2017 | | 2017 |
| Forming die backside coating structures with coreless packages RN Manepalli, M Mamodia, D Xu, JS Gonzalez, ER Prack US Patent 9,165,914, 2015 | | 2015 |
| Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same JS Guzek, RK Nalla, JS Gonzalez, D Delaney, S Pothukuchi, M Mamodia, ... US Patent App. 14/333,110, 2014 | | 2014 |
