| A study on wafer level vacuum packaging for MEMS devices B Lee, S Seok, K Chun Journal of micromechanics and microengineering 13 (5), 663, 2003 | 193 | 2003 |
| A study on resonant frequency and Q factor tunings for MEMS vibratory gyroscopes C Jeong, S Seok, B Lee, H Kim, K Chun Journal of micromechanics and microengineering 14 (11), 1530, 2004 | 101 | 2004 |
| Development and analysis of the vertical capacitive accelerometer I Lee, GH Yoon, J Park, S Seok, K Chun, KI Lee Sensors and Actuators A: Physical 119 (1), 8-18, 2005 | 99 | 2005 |
| A novel linearly tunable MEMS variable capacitor S Seok, W Choi, K Chun Journal of Micromechanics and Microengineering 12 (1), 82, 2001 | 75 | 2001 |
| Analysis of piezoelectric energy harvesting system with tunable SECE interface E Lefeuvre, A Badel, A Brenes, S Seok, M Woytasik, CS Yoo Smart Materials and Structures 26 (3), 035065, 2017 | 68 | 2017 |
| Power and frequency bandwidth improvement of piezoelectric energy harvesting devices using phase-shifted synchronous electric charge extraction interface circuit E Lefeuvre, A Badel, A Brenes, S Seok, CS Yoo Journal of Intelligent Material Systems and Structures 28 (20), 2988-2995, 2017 | 66 | 2017 |
| Inertial-grade out-of-plane and in-plane differential resonant silicon accelerometers (DRXLs) HC Kim, S Seok, I Kim, SD Choi, K Chun The 13th International Conference on Solid-State Sensors, Actuators and …, 2005 | 64 | 2005 |
| Packaging methodology for RF devices using a BCB membrane transfer technique S Seok, N Rolland, PA Rolland Journal of micromechanics and microengineering 16 (11), 2384, 2006 | 54 | 2006 |
| An inertial-grade laterally-driven MEMS differential resonant accelerometer S Seok, H Kim, K Chun SENSORS, 2004 IEEE, 654-657, 2004 | 43 | 2004 |
| Design, fabrication, and measurement of benzocyclobutene polymer zero-level packaging for millimeter-wave applications S Seok, N Rolland, PA Rolland IEEE transactions on microwave theory and techniques 55 (5), 1040-1045, 2007 | 37 | 2007 |
| A high performance mixed micromachined differential resonant accelerometer S Seok, S Seong, B Lee, J Kim, K Chun SENSORS, 2002 IEEE 2, 1058-1063, 2002 | 34 | 2002 |
| Inertial-grade in-plane resonant silicon accelerometer S Seok, K Chun Electronics Letters 42 (19), 1092-1094, 2006 | 33 | 2006 |
| Design, fabrication, and characterization of a wideband 60 GHz bandpass filter based on a flexible PerMX polymer substrate S Seok, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (8 …, 2013 | 28 | 2013 |
| A novel packaging method using wafer-level BCB polymer bonding and glass wet-etching for RF applications S Seok, N Rolland, PA Rolland Sensors and Actuators A: Physical 147 (2), 677-682, 2008 | 24 | 2008 |
| A high performance solenoid-type MEMS inductor S Seok, C Nam, W Park, K Chun JSTS: Journal of Semiconductor Technology and Science 1 (3), 182-188, 2001 | 24 | 2001 |
| A vertically guided MEMS probe card with deeply recessed trench-type cantilever BH Kirn, DY Chung, CH Chung, TU Chun, SH Seok, HC Kim, K Chun 18th IEEE International Conference on Micro Electro Mechanical Systems, 2005 …, 2005 | 22 | 2005 |
| Mechanical and electrical characterization of benzocyclobutene membrane packaging S Seok, N Rolland, PA Rolland 2007 Proceedings 57th Electronic Components and Technology Conference, 1685-1689, 2007 | 20 | 2007 |
| Unipolar synchronized electric charge extraction for piezoelectric energy harvesting A Brenes, E Lefeuvre, A Badel, S Seok, CS Yoo Smart Materials and Structures 27 (7), 075054, 2018 | 19 | 2018 |
| A new compensation method for the footing effect in MEMS fabrication S Seok, B Lee, J Kim, H Kim, K Chun Journal of Micromechanics and Microengineering 15 (10), 1791, 2005 | 19 | 2005 |
| Fabrication and modeling of nitride thin-film encapsulation based on anti-adhesion-assisted transfer technique and nitride/BCB bilayer wrinkling S Seok IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (9 …, 2016 | 17 | 2016 |
