Heat dissipation design and analysis of high power LED array using the finite element method HH Cheng, DS Huang, MT Lin
Microelectronics Reliability 52 (5), 905-911, 2012
191 2012 Design of fins with a grooved heat pipe for dissipation of heat from high-powered automotive LED headlights DS Huang, TC Chen, LT Tsai, MT Lin
Energy conversion and management 180, 550-558, 2019
64 2019 Influence of in situ applied stress during thermal oxidation of (111)Si on interface defects A Stesmans, D Pierreux, RJ Jaccodine, MT Lin, TJ Delph
Applied physics letters 82 (18), 3038-3040, 2003
43 2003 Novel microtensile method for monotonic and cyclic testing of freestanding copper thin films MT Lin, CJ Tong, KS Shiu
Experimental Mechanics 50, 55-64, 2010
29 2010 Temperature-dependent microtensile testing of thin film materials for application to microelectromechanical system MT Lin, P El-Deiry, RR Chromik, N Barbosa, WL Brown, TJ Delph, ...
Microsystem technologies 12, 1045-1051, 2006
28 2006 Thin-film vertical-type AlGaInP LEDs fabricated by epitaxial lift-off process via the patterned design of Cu substrate FL Wu, SL Ou, YC Kao, CL Chen, MC Tseng, FC Lu, MT Lin, RH Horng
Optics Express 23 (14), 18156-18165, 2015
26 2015 Driving forces for texture transformation in thin Ag films EA Ellis, M Chmielus, MT Lin, H Joress, K Visser, A Woll, RP Vinci, ...
Acta Materialia 105, 495-504, 2016
25 2016 Microsyst. Technol MT Lin, MT Lin, SP Wu, FG Tseng
25 2006 Effects of electrical current and external stress on the electromigration of intermetallic compounds between the flip-chip solder and copper substrate WJ Chen, YL Lee, TY Wu, TC Chen, CH Hsu, MT Lin
Journal of Electronic Materials 47, 35-48, 2018
23 2018 Viscoelastic mechanical properties measurement of thin Al and Al–Mg films using bulge testing AW Huang, CH Lu, SC Wu, TC Chen, RP Vinci, WL Brown, MT Lin
Thin Solid Films 618, 2-7, 2016
22 2016 Optical micro-paddle beam deflection measurement for electrostatic mechanical testing of nano-scale thin film application to MEMS CJ Tong, YC Cheng, MT Lin, KJ Chung, JS Hsu, CL Wu
microsystem technologies 16, 1131-1137, 2010
20 2010 Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains WK Liao, CM Chen, MT Lin, CH Wang
Scripta Materialia 65 (8), 691-694, 2011
19 2011 Design and development of a novel paddle test structure for the mechanical behavior measurement of thin films application for MEMS CJ Tong, MT Lin
Microsystem technologies 15, 1207-1216, 2009
16 2009 Heat dissipation performance for the application of light emitting diode MT Lin, C Chang, RH Horng, DS Huang, CM Lai
2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, 145-149, 2009
16 2009 Advancements in optical methods & digital image correlation in experimental mechanics MT Lin, CA Sciammarella, HD Espinosa, C Furlong, L Lamberti, P Reu, ...
Springer, 2020
15 * 2020 Cyclic creep and fatigue testing of nanocrystalline copper thin films TC Hu, YT Wang, FC Hsu, PK Sun, MT Lin
Surface and Coatings Technology 215, 393-399, 2013
14 2013 Design and development of sub-micron scale specimens with electroplated structures for the microtensile testing of thin films MT Lin, CJ Tong, CH Chiang
Microsystem technologies 13, 1559-1565, 2007
13 2007 Digital image correlation of SEM images for surface deformation of CMOS IC TYF Chen, TC Chen, FY Cheng, AT Tsai, MT Lin
Microelectronic Engineering 201, 16-21, 2018
12 2018 Three-phase linear motor heat transfer analysis using the finite-element method DS Huang, JS Shih, HC Hsia, MT Lin
Heat Transfer Engineering 31 (7), 617-624, 2010
12 2010 Monotonic and fatigue testing of freestanding submicron thin beams application for MEMS MT Lin, CJ Tong, KS Shiu
Microsystem technologies 14, 1041-1048, 2008
12 2008