Kukjin Chun
Kukjin Chun
Seoul National University, Department of Electrical and Computer Engineering
Verified email at snu.ac.kr - Homepage
TitleCited byYear
A study on wafer level vacuum packaging for MEMS devices
B Lee, S Seok, K Chun
Journal of micromechanics and microengineering 13 (5), 663, 2003
Establishment of a fabrication method for a long-term actuated hybrid cell robot
J Kim, J Park, S Yang, J Baek, B Kim, SH Lee, ES Yoon, K Chun, S Park
Lab on a Chip 7 (11), 1504-1508, 2007
Polysilicon surface-modification technique to reduce sticking of microstructures
Y Yee, K Chun, JD Lee, CJ Kim
Sensors and Actuators A: Physical 52 (1-3), 145-150, 1996
In-plane single-crystal-silicon microneedles for minimally invasive microfluid systems
SJ Paik, S Byun, JM Lim, Y Park, A Lee, S Chung, J Chang, K Chun
Sensors and Actuators A: Physical 114 (2-3), 276-284, 2004
A highly efficient 3D micromixer using soft PDMS bonding
J Cha, J Kim, SK Ryu, J Park, Y Jeong, S Park, S Park, HC Kim, K Chun
Journal of micromechanics and microengineering 16 (9), 1778, 2006
A study on resonant frequency and Q factor tunings for MEMS vibratory gyroscopes
C Jeong, S Seok, B Lee, H Kim, K Chun
Journal of micromechanics and microengineering 14 (11), 1530, 2004
A new organic modifier for anti-stiction
BH Kim, TD Chung, CH Oh, K Chun
Journal of microelectromechanical systems 10 (1), 33-40, 2001
A high-performance silicon tactile imager based on a capacitive cell
K Chun, KD Wise
IEEE Transactions on Electron Devices 32 (7), 1196-1201, 1985
Development and analysis of the vertical capacitive accelerometer
I Lee, GH Yoon, J Park, S Seok, K Chun, KI Lee
Sensors and Actuators A: Physical 119 (1), 8-18, 2005
A sticking model of suspended polysilicon microstructure including residual stress gradient and postrelease temperature
Y Yee, M Park, K Chun
Journal of Microelectromechanical Systems 7 (3), 339-344, 1998
A novel linearly tunable MEMS variable capacitor
S Seok, W Choi, K Chun
Journal of Micromechanics and Microengineering 12 (1), 82, 2001
A vacuum packaged differential resonant accelerometer using gap sensitive electrostatic stiffness changing effect
BL Lee, C Oh, S Lee, YS Oh, K Chun
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro …, 2000
Side-bonding method of flip-chip semiconductor device, MEMS device package and package method using the same
ES Lee, B Koh, C Moon, K Chun
US Patent 6,884,650, 2005
Inertial-grade out-of-plane and in-plane differential resonant silicon accelerometers (DRXLs)
HC Kim, S Seok, I Kim, SD Choi, K Chun
The 13th International Conference on Solid-State Sensors, Actuators and …, 2005
Package embedded heat exchanger for stacked multi-chip module
H Lee, Y Jeong, J Shin, J Baek, M Kang, K Chun
Sensors and Actuators A: Physical 114 (2-3), 204-211, 2004
Quantitative evaluation of cardiomyocyte contractility in a 3D microenvironment
J Kim, J Park, K Na, S Yang, J Baek, E Yoon, S Choi, S Lee, K Chun, ...
Journal of biomechanics 41 (11), 2396-2401, 2008
A low-loss, single-pole, four-throw RF MEMS switch driven by a double stop comb drive
S Kang, HC Kim, K Chun
Journal of Micromechanics and Microengineering 19 (3), 035011, 2009
Fabrication of an electrostatic track-following micro actuator for hard disk drives using SOI wafer
BH Kim, K Chun
Journal of Micromechanics and microengineering 11 (1), 1, 2001
A capacitive silicon tactile imaging array
KJ Chun, KD Wise
IEEE International Conference on Solid-State Sensors and Actuators, 22-25, 1985
A novel 3D process for single-crystal silicon micro-probe structures
S Park, B Kim, J Kim, S Paik, BD Choi, I Jung, K Chun
Journal of micromechanics and microengineering 12 (5), 650, 2002
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