| Additive manufacturing for enhancing thermal dissipation in heat sink implementation: a review BM Nafis, R Whitt, AC Iradukunda, D Huitink Heat Transfer Engineering 42 (12), 967-984, 2021 | 58 | 2021 |
| Design and evaluation of a 150 kva sic mosfet based three level tnpc phase-leg pebb for aircraft motor driving application Z Yuan, A Deshpande, B Narayanasamy, H Peng, AI Emon, R Whitt, ... 2019 IEEE Energy Conversion Congress and Exposition (ECCE), 6569-6574, 2019 | 37 | 2019 |
| Thermal and electrical performance in high-voltage power modules with nonmetallic additively manufactured impingement coolers R Whitt, D Huitink, A Emon, A Deshpande, F Luo IEEE transactions on power electronics 36 (3), 3192-3199, 2020 | 26 | 2020 |
| Heat transfer and pressure drop performance of additively manufactured polymer heat spreaders for low-weight directed cooling integration in power electronics R Whitt, B Nafis, D Huitink, Z Yuan, A Deshpande, B Narayanasamy, ... 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 16 | 2019 |
| Additive manufactured impinging coolant, low electromagnetic interference, and nonmetallic heat spreader: Design and optimization R Whitt, S Hudson, D Huitink, Z Yuan, A Emon, F Luo Journal of Electronic Packaging 142 (4), 041004, 2020 | 9 | 2020 |
| Additive Manufactured, Low EMI, Non-Metallic Convective Heat Spreader Design and Optimization R Whitt, D Huitink, S Hudson, B Nafis, Z Yuan, B Narayanasamy, ... International Electronic Packaging Technical Conference and Exhibition 59322 …, 2019 | 6 | 2019 |
| Electrothermal system design and evaluation of low EMI and thermally balanced 150 kW T-type traction inverter R Whitt, Z Yuan, AI Emon, F Luo, D Huitink IEEE Transactions on Power Electronics 38 (1), 538-547, 2022 | 5 | 2022 |
| Thermal validations of additive manufactured non-metallic heat spreading device for hot spot mitigation in power modules R Whitt, D Huitink International Symposium on Microelectronics 2019 (1), 000398-000403, 2019 | 5 | 2019 |
| Additive manufactured impinging coolant, low EMI, & non-metallic heat spreader: Design and optimization R Whitt, SJ Hudson, D Huitink, Z Yuan, A Emon, F Luo Journal of Electronic Packaging, 2020 | 4 | 2020 |
| Helical fin design by additive manufacturing of metal for enhanced heat sink for electronics cooling D Huitink, BM Nafis, R Whitt US Patent 11,071,234, 2021 | 3 | 2021 |
| Fabrication and Experimental Validation of Low Inductance SiC Power Module with Integrated Microchannel Cooler H Chen, Y Lin, T Wei, X Li, R Paul, R Whitt, X Song, Y Zhao, M Asheghi, ... 2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 366-371, 2023 | 1 | 2023 |
| Thermal management performance of an additively manufactured jet impingement cooler for power electronics R Whitt, D Huitink 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 1 | 2022 |
| Converging Jet Impingement for Enhanced Liquid Cooling R Whitt, R Estrella, D Huitink Journal of Electronic Packaging 145 (4), 041103, 2023 | | 2023 |
| Variable Area Jet Impingement for High Voltage Power Electronics R Whitt, D Huitink International Electronic Packaging Technical Conference and Exhibition 87516 …, 2023 | | 2023 |
| Advanced Jet Impingement Cooling for Power Electronics R Whitt | | 2023 |
| Dual Converging Jets for Enhanced Liquid Impingement Cooling R Whitt, R Estrella, D Huitink International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | | 2022 |
| Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling Z Clarke, S Smith, R Whitt, D Huitink International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | | 2022 |
| Nonmetallic Jet Impingement Thermal Management for Power Electronics via Additive Manufacturing R Whitt University of Arkansas, 2021 | | 2021 |
| Silicone-Iron Oxide Nanocomposite Encapsulants for Common Mode Noise Reduction in Switching Power Electronics H Carlton, R Whitt, A Deshpande, S Myane, N Akey, D Huitink Bulletin of the American Physical Society 65, 2020 | | 2020 |
David HuitinkAssociate Professor of Mechanical Engineering, University of ArkansasDirección de correo verificada de uark.edu
