| Architectural implications and process development of 3-D VLSI Z-axis interconnects using through silicon vias LW Schaper, SL Burkett, S Spiesshoefer, GV Vangara, Z Rahman, ... IEEE Transactions on Advanced Packaging 28 (3), 356-366, 2005 | 102 | 2005 |
| Process integration for through-silicon vias S Spiesshoefer, Z Rahman, G Vangara, S Polamreddy, S Burkett, ... Journal of Vacuum Science & Technology A 23 (4), 824-829, 2005 | 100 | 2005 |
| Z-axis interconnects using fine pitch, nanoscale through-silicon vias: Process development S Spiesshoefer, L Schaper, S Burkett, G Vangara, Z Rahman, ... 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 46 | 2004 |
| Experimental study and design of biomass co-firing in a full-scale coal-fired furnace with storage pulverizing system X Wang, ZU Rahman, Z Lv, Y Zhu, R Ruan, S Deng, L Zhang, H Tan Agronomy 11 (4), 810, 2021 | 32 | 2021 |
| Combustibility and cofiring of coal gasification fine ash with high carbon content in a full-scale pulverized coal furnace X Liu, X Wang, H Sheng, J Zhang, C Yang, Z Rahman, L Zhang, H Tan Energy & Fuels 34 (10), 12972-12983, 2020 | 8 | 2020 |
| Experimental study on pore structure and mechanical dehydration of coal gasification fine slag W Yu, X Wang, L Liu, Z Shi, L Wang, ZIAU Rahman Energy Sources, Part A: Recovery, Utilization, and Environmental Effects 44 …, 2022 | 7 | 2022 |
| Experimental investigation of the NOx formation and control during the self-sustaining incineration process of N-containing VOCs (DIMETHYLFORMAMIDE) S Zheng, Y Qian, X Wang, M Vujanović, Y Zhang, ZU Rahman, P Yang, ... Fuel 315, 123149, 2022 | 6 | 2022 |
| Ultra Thin Wafer Processing for Through-silicon Via (TSV) in 3D VLSI Z-axis Interconnect Technology Z Rahman University of Arkansas, Fayetteville, 2005 | 2 | 2005 |
| Interactions of HCN with NO in pressurized oxy‐combustion Z Lv, Z Rahman, X Wang, X Xiong, H Tan Asia‐Pacific Journal of Chemical Engineering 18 (1), e2851, 2023 | 1 | 2023 |
| Characterizing moisture occurrence state in coal gasification fine slag filter cake using low field nuclear magnetic resonance technology W Yu, X Wang, L Liu, H Tan, ZU Rahman Energy Sources, Part A: Recovery, Utilization, and Environmental Effects 45 …, 2023 | | 2023 |
| 9: 15 F-3-1 Process Realization for 3-D ICs using Fine PitchThrough Silicon Vias L Schaper, S Spiesshoefer, S Burkett, G Vangara, Z Rahman, ... SOLID STATE DEVICES AND MATERIALS, 274-275, 2004 | | 2004 |
| Process Realization for 3-D ICs using Fine Pitch Through Silicon Vias L Schaper, S Spiesshoefer, S Burkett, G Vangara, Z Rahman, ... | | |
| SPECIAL SECTION ON THREE-DIMENSIONAL PACKAGING LW Schaper, SL Burkett, S Spiesshoefer, GV Vangara, Z Rahman, ... | | |
