| Assist gate driver circuit on crosstalk suppression for SiC MOSFET bridge configuration H Li, Y Zhong, R Yu, R Yao, H Long, X Wang, Z Huang IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (2 …, 2019 | 33 | 2019 |
| Thermal contact resistance optimization of press-pack IGBT device based on liquid metal thermal interface material X Wang, H Li, R Yao, W Lai, R Liu, R Yu, X Chen, J Li IEEE Transactions on Power Electronics 37 (5), 5411-5421, 2021 | 25 | 2021 |
| A study on the failure evolution to short circuit of nanosilver sintered press-pack IGBT H Li, H Long, R Yao, X Wang, Y Zhong, R Yu, J Li IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2019 | 15 | 2019 |
| Optimization on thermomechanical behavior for improving the reliability of press pack IGBT using response surface method H Li, R Yu, R Yao, X Wang, J Li, R Liu, Y Yu, X Chen IEEE Journal of Emerging and Selected Topics in Power Electronics 9 (5 …, 2021 | 10 | 2021 |
| Design of 400 V miniature DC solid state circuit breaker with SiC MOSFET H Li, R Yu, Y Zhong, R Yao, X Liao, X Chen Micromachines 10 (5), 314, 2019 | 10 | 2019 |
| Study on the method to analyze the electrical contact resistances of press-pack IGBT devices X Wang, H Li, R Yao, H Long, Y Zhong, R Yu, J Li 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 613-617, 2019 | 7 | 2019 |
| Degradation analysis of planar, symmetrical and asymmetrical trench SiC MOSFETs under repetitive short circuit impulses R Yu, S Jahdi, P Mellor, L Liu, J Yang, C Shen, O Alatise, J Ortiz-Gonzalez IEEE Transactions on Power Electronics, 2023 | 4 | 2023 |
| Analysis on the reliability effect of solder voids on the nanosilver sintered press-pack IGBT L Renkuan, L Hul, L Haiyang, L Wei, W Xiao, Y Ran, Y Renze, Y Yue 2020 4th International Conference on HVDC (HVDC), 20-25, 2020 | 4 | 2020 |
| Investigation of repetitive short circuit stress as a degradation metric in symmetrical and asymmetrical double-trench sic power mosfets R Yu, S Jahdi, P Mellor, J Yang, C Shen, L Liu, O Alatise, J Ortiz-Gonzalez 2022 IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe …, 2022 | 2 | 2022 |
| Measurements and Review of Failure Mechanisms and Reliability Constraints of 4H-SiC Power MOSFETs Under Short Circuit Events R Yu, S Jahdi, O Alatise, J Ortiz-Gonzalez, SP Munagala, N Simpson, ... IEEE Transactions on Device and Materials Reliability, 2023 | 1 | 2023 |
| Unclamped inductive stressing of GaN and SiC Cascode power devices to failure at elevated temperatures Y Gunaydin, S Jahdi, X Yuan, R Yu, C Shen, SP Munagala, A Hopkins, ... Microelectronics Reliability 138, 114711, 2022 | 1 | 2022 |
| FEM-based analysis of avalanche ruggedness of high voltage SiC Merged-PiN-Schottky and Junction-Barrier-Schottky diodes C Shen, R Yu, S Jahdi, P Mellor, SP Munagala, A Hopkins, N Simpson, ... Microelectronics Reliability 138, 114686, 2022 | 1 | 2022 |
| Improved Temperature Estimation Model of 4H-SiC MOSFET under Avalanche Condition R Yu, H Li, Y Zhong, W Lai, X Wang, R Yao, R Liu, Y Yu 2020 4th International Conference on HVDC (HVDC), 874-879, 2020 | 1 | 2020 |
| Impact of Intrinsic Parameter Dispersion on Short-Circuit Reliability of Parallel-Connected Planar and Trench SiC MOSFETs R Yu, S Jahdi, P Mellor IEEE Transactions on Industrial Electronics, 2024 | | 2024 |
| Electrothermal power cycling of GaN and SiC cascode devices Y Gunaydin, S Jahdi, R Yu, X Yuan, O Alatise, JO Gonzalez Microelectronics Reliability 150, 115117, 2023 | | 2023 |
| Electrothermal Power Cycling to Failure of Discrete Planar, Symmetrical Double-Trench & Asymmetrical Trench SiC MOSFETs J Yang, S Jahdi, R Yu, B Stark IEEE Open Journal of Power Electronics, 2023 | | 2023 |
| Degradation Pattern of Parallel Symmetrical and Asymmetrical Double-Trench SiC MOSFETs under Repetitive Short Circuits R Yu, S Jahdi, J Yang, P Mellor, JO Gonzalez, O Alatise PCIM Europe 2023; International Exhibition and Conference for Power …, 2023 | | 2023 |
| Experimental Analysis of Short Circuit Robustness of GaN and SiC Cascode Devices Y Gunaydin, S Jahdi, X Yuan, C Shen, M Hosseinzadelish, R Yu, ... PCIM Europe 2023; International Exhibition and Conference for Power …, 2023 | | 2023 |
| Impact of Electrothermal Bias Temperature Instability Stress on Threshold Voltage Drift of GaN Cascode Power Modules Y Gunaydin, S Jahdi, X Yuan, J Yang, R Yu, B Stark 2022 IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe …, 2022 | | 2022 |
