Weng Hong Teh
Weng Hong Teh
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Effect of low numerical-aperture femtosecond two-photon absorption on (SU-8) resist for ultrahigh-aspect-ratio microstereolithography
WH Teh, U Dürig, U Drechsler, CG Smith, HJ Güntherodt
Journal of applied physics 97 (5), 054907, 2005
1672005
SU-8 for real three-dimensional subdiffraction-limit two-photon microfabrication
WH Teh, U Dürig, G Salis, R Harbers, U Drechsler, RF Mahrt, CG Smith, ...
Applied Physics Letters 84 (20), 4095-4097, 2004
1212004
Cross-linked PMMA as a low-dimensional dielectric sacrificial layer
WH Teh, CT Liang, M Graham, CG Smith
Journal of microelectromechanical systems 12 (5), 641-648, 2003
722003
Study of microstructure and resistivity evolution for electroplated copper films at near-room temperature
WH Teh, LT Koh, SM Chen, J Xie, CY Li, PD Foo
Microelectronics Journal 32 (7), 579-585, 2001
612001
High density substrate routing in BBUL package
WH Teh, CP Chiu
US Patent 9,190,380, 2015
432015
Near-zero curvature fabrication of miniaturized micromechanical Ni switches using electron beam cross-linked PMMA
WH Teh, JK Luo, MR Graham, A Pavlov, CG Smith
Journal of Micromechanics and Microengineering 13 (5), 591, 2003
352003
Bumpless build-up layer package including an integrated heat spreader
WH Teh, D Kulkarni, CP Chiu, T Harirchian, JS Guzek
US Patent 8,912,670, 2014
262014
Semiconductor package with mechanical fuse
WH Teh, KL Lin, F Eid, Q Ma
US Patent 8,633,551, 2014
252014
Secondary device integration into coreless microelectronic device packages
WH Teh, JS Guzek
US Patent 8,937,382, 2015
222015
Fabrication of quasi-three-dimensional micro/nanomechanical components using electron beam cross-linked poly (methyl methacrylate) resist
WH Teh, CG Smith
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2003
222003
Embedded structures for package-on-package architecture
WH Teh, V Raghunathan
US Patent 8,866,287, 2014
212014
High density substrate routing in BBUL package
WH Teh, CP Chiu
US Patent 9,171,816, 2015
202015
Bumpless build-up layer package including an integrated heat spreader
WH Teh, D Kulkarni, CP Chiu, T Harirchian, JS Guzek
US Patent 9,153,552, 2015
192015
Etching control of benzocyclobutene in CF4/O2 and SF6/O2 plasmas with thick photoresist and titanium masks
EB Liao, WH Teh, KW Teoh, AAO Tay, HH Feng, R Kumar
Thin solid films 504 (1-2), 252-256, 2006
172006
Backside infrared interferometric patterned wafer thickness sensing for through-silicon-via (TSV) etch metrology
WH Teh, D Marx, D Grant, R Dudley
IEEE transactions on semiconductor manufacturing 23 (3), 419-422, 2010
162010
Semiconductor package with air pressure sensor
KL Lin, Q Ma, F Eid, J Swan, WH Teh
US Patent 9,200,973, 2015
152015
High density substrate routing in BBUL package
WH Teh, CP Chiu
US Patent 9,437,569, 2016
142016
Multi-strata stealth dicing before grinding for singulation-defects elimination and die strength enhancement: Experiment and simulation
WH Teh, DS Boning, RE Welsch
IEEE Transactions on Semiconductor Manufacturing 28 (3), 408-423, 2015
142015
Wafer thickness sensor (WTS) for etch depth measurement of TSV
D Marx, D Grant, R Dudley, A Rudack, WH Teh
2009 IEEE International Conference on 3D System Integration, 1-5, 2009
142009
Integrating vertically aligned carbon nanotubes on micromechanical structures
WH Teh, CG Smith, KBK Teo, RG Lacerda, GAJ Amaratunga, WI Milne, ...
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 2003
132003
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