Segueix
BIN YAN
BIN YAN
National University of Singapore
No hi ha cap correu electrònic verificat
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An experimental and numerical study of plunging wave impact on a box-shape structure
B Yan, M Luo, W Bai
Marine Structures 66, 272-287, 2019
452019
Numerical investigation of wave forces on two side-by-side non-identical boxes in close proximity under wave actions
SC Jiang, W Bai, PW Cong, B Yan
Marine Structures 63, 16-44, 2019
402019
Higher-order harmonic induced wave resonance for two side-by-side boxes in close proximity
SC Jiang, W Bai, B Yan
Physics of Fluids 33 (10), 2021
292021
Three-dimensional sloshing in a scaled membrane LNG tank under combined roll and pitch excitations
M Luo, X Wang, X Jin, B Yan
Ocean Engineering 211, 107578, 2020
252020
Study on hydro-kinematic characteristics of green water over different fixed decks using immersed boundary method
B Yan, W Bai, L Qian, Z Ma
Ocean Engineering 164, 74-86, 2018
112018
Numerical simulations for internal baffle effect on suppressing sway-sloshing coupled motion response
SC Jiang, A Feng, B Yan
Ocean Engineering 250, 110513, 2022
92022
An improved immersed boundary method with new forcing point searching scheme for simulation of bodies in free surface flows
B Yan, W Bai, ST Quek
Communications in Computational Physics 24 (3), 830-859, 2018
42018
A three-dimensional immersed boundary method based on an algebraic forcing-point-searching scheme for water impact problems
B Yan, W Bai, SC Jiang, P Cong, D Ning, L Qian
Ocean Engineering 233, 109189, 2021
32021
波浪对淹没水平圆柱作用的非线性数值模拟
严斌, 林红星, 宁德志
海洋科学进展 31 (3), 319-325, 2013
22013
Improvement of Warping Simulation Accuracy and Influence Factors Analysis in FCBGA Package
YB Wang, B Yan
Semiconductor Equipment and Materials International(China), 2024
2024
A Modularized Thermal Test Chip Design and Verification
JJ Sun, B Yan
Semiconductor Equipment and Materials International(China), 2024
2024
Thermal Resistance Simulation Analysis and Test Research of Wire Bond Ball Grid Array Package
F Qu, B Yan
The International Conference on Electronic Packaging Technology, 2023
2023
先进封装材料(散热材料&基板材料)
B Yan
CMC中国材料大会 - 集成电路材料产业发展论坛, 2023
2023
High performance TIM1 for CoWoS Package
JJ Sun, B Yan, et al.
TSMC 2022 China OIP Ecosystem Forum, 2022
2022
Accurate 3DIC thermal simulation for BEOL Influence study
H Yang, B Yan, et al
2022 IEEE International Conference on Integrated Circuits, Technologies and …, 2022
2022
Numerical Simulation of Greenwater on the Deck of Offshore Structures Using a Combined Level Set Immersed Boundary Method
Y Bin
PQDT-Global, 2018
2018
Green water over a fixed deck by immersed boundary method
B Yan, W Bai, ST Quek
10th International Workshop on Ship and Marine Hydrodynmics, 1-10, 2017
2017
Numerical simulation of free fall of a wedge using an improved Immersed Boundary Method
B YAN, W BAI
The twenty-eighth KKHTCNN symposium on Civil Engineering, 2015
2015
海洋环流模式中的二阶湍流封闭格式综述
梁书秀, 严斌, 孙昭晨, 张怡辉
水利水电科技进展 34 (4), 82-88, 2014
2014
En aquests moments el sistema no pot dur a terme l'operació. Torneu-ho a provar més tard.
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