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Srividya Jayaram
Srividya Jayaram
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Lithographic benefits and mask manufacturability study of curvilinear masks
VW Guo, F Jiang, J Rankin, I Bork, A Tritchkov, A Wei, Y Sun, S Jayaram, ...
Photomask Technology 2018 10810, 106-118, 2018
152018
Reduction of systematic defects with machine learning from design to fab
Y Ma, L Hong, J Word, F Jiang, V Liubich, L Cao, S Jayaram, D Kwak, ...
Advanced Etch Technology for Nanopatterning IX 11329, 12-25, 2020
122020
Effective model-based SRAF placement for full chip 2D layouts
S Jayaram, P LaCour, J Word, A Tritchkov
Optical Microlithography XXVI 8683, 132-140, 2013
112013
Impact of illumination source symmetrization in OPC
JL Sturtevant, L Hong, S Jayaram, SP Renwick, M McCallum, ...
Photomask and Next-Generation Lithography Mask Technology XV 7028, 1078-1087, 2008
112008
Subresolution assist features impact and implementation in extreme ultraviolet lithography for next-generation beyond 7-nm node
VW Guo, F Jiang, A Tritchkov, S Jayaram, S Mansfield, L Zhuang, Y Sun, ...
Journal of Micro/Nanolithography, MEMS, and MOEMS 18 (1), 011003-011003, 2019
92019
Automatic assist feature placement optimization based on process-variability reduction
S Jayaram, A Yehia, M Bahnas, HAM Omar, Z Bozkus, JL Sturtevant
Photomask Technology 2007 6730, 816-824, 2007
92007
Model-based SRAF solutions for advanced technology nodes
S Jayaram, P LaCour, J Word, A Tritchkov
29th European Mask and Lithography Conference 8886, 174-182, 2013
82013
Exposure tool specific post-OPC verification
J Sturtevant, S Jayaram, L Hong
Design for Manufacturability through Design-Process Integration II 6925, 245-253, 2008
72008
SRAF requirements, relevance, and impact on EUV lithography for next-generation beyond 7nm node
VW Guo, F Jiang, A Tritchkov, S Jayaram, S Mansfield, L Zhuang, Y Sun, ...
Extreme Ultraviolet (EUV) Lithography IX 10583, 149-160, 2018
52018
Automatic SRAF size optimization during OPC
S Jayaram, J Word
Optical Microlithography XXII 7274, 789-798, 2009
52009
Process variability band analysis for quantitative optimization of exposure conditions
JL Sturtevant, S Jayaram, L Hong
Design for Manufacturability through Design-Process Integration III 7275 …, 2009
52009
Novel method for optimizing lithography exposure conditions using full-chip post-OPC simulation
J Sturtevant, S Jayaram, L Hong, A Drozdov
Optical Microlithography XXI 6924, 1252-1262, 2008
52008
Virtual cross metrology: leveraging process sequence for improved process characterization
JA Torres, I Kissiov, M Tao, G Mueller, S Schueler, C Hartig, R Gardner, ...
Metrology, Inspection, and Process Control XXXVI 12053, 430-440, 2022
42022
Virtual metrology: how to build the bridge between the different data sources
S Schueler, C Hartig, A Torres, I Kissiov, R Gardner, E Mohamed, ...
Metrology, Inspection, and Process Control for Semiconductor Manufacturing …, 2021
42021
Influence of the illumination source on model-based SRAF placement
R Gupta, A Dave, E Tejnil, S Jayaram, P LaCour
Optical Microlithography XXIV 7973, 627-634, 2011
42011
EUV implementation of assist features in contact patterns
F Jiang, A Raghunathan, M Burkhardt, N Saulnier, A Tritchkov, S Jayaram, ...
Extreme Ultraviolet (EUV) Lithography VII 9776, 530-540, 2016
22016
Impact of illumination on model-based SRAF placement for contact patterning
JL Sturtevant, S Jayaram, O El-Sewefy, A Dave, P LaCour
Optical Microlithography XXIII 7640, 1080-1085, 2010
22010
The PIXBAR OPC for contact-hole pattern in sub-70-nm generation
KY Chen, CC Liao, SH Chen, T Wey, P Cheng, P Chou, J Schacht, ...
Design for Manufacturability through Design-Process Integration III 7275 …, 2009
22009
Image parameter-based scatter bar optimization
R Chou, LT Hsiao, HY Liao, J Lin, R Shen, J Schacht, D Chou, S Jayaram, ...
Lithography Asia 2008 7140, 574-585, 2008
22008
Design-aware virtual metrology and process recipe recommendation
NG Greeneltch, H Yin, JA Torres, M Tao, SM Lubin, S Jayaram, I Kissiov, ...
DTCO and Computational Patterning II 12495, 445-450, 2023
12023
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Artículos 1–20