| Measurement and interpretation of stress in aluminum-based metallization as a function of thermal history PA Flinn, DS Gardner, WD Nix IEEE Transactions on electron devices 34 (3), 689-699, 1987 | 743 | 1987 |
| Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniques MF Doerner, DS Gardner, WD Nix Journal of Materials Research 1 (6), 845-851, 1986 | 461 | 1986 |
| Embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias DS Gardner US Patent 5,414,221, 1995 | 424 | 1995 |
| A 233-MHz 80%-87% efficient four-phase DC-DC converter utilizing air-core inductors on package P Hazucha, G Schrom, J Hahn, BA Bloechel, P Hack, GE Dermer, ... IEEE Journal of Solid-State Circuits 40 (4), 838-845, 2005 | 411 | 2005 |
| Review of on-chip inductor structures with magnetic films DS Gardner, G Schrom, F Paillet, B Jamieson, T Karnik, S Borkar IEEE Transactions on Magnetics 45 (10), 4760-4766, 2009 | 378 | 2009 |
| Methods of forming an interconnect on a semiconductor substrate XC Mu, S Sivaram, DS Gardner, DB Fraser US Patent 5,612,254, 1997 | 367 | 1997 |
| Method for the anisotropic etching of metal films in the fabrication of interconnects DS Gardner, XC Mu, DB Fraser US Patent 5,350,484, 1994 | 229 | 1994 |
| Mechanical stress as a function of temperature in aluminum films DS Gardner, PA Flinn IEEE Transactions on electron devices 35 (12), 2160-2169, 1988 | 210 | 1988 |
| Integrated on-chip inductors with magnetic films DS Gardner, G Schrom, P Hazucha, F Paillet, T Karnik, S Borkar, ... 2006 International Electron Devices Meeting, 1-4, 2006 | 162 | 2006 |
| Method of forming a high surface area interconnection structure DS Gardner US Patent 5,817,574, 1998 | 162 | 1998 |
| A 480-MHz, multi-phase interleaved buck DC-DC converter with hysteretic control G Schrom, P Hazucha, J Hahn, DS Gardner, BA Bloechel, G Dermer, ... 2004 IEEE 35th annual power electronics specialists conference (IEEE Cat. No …, 2004 | 158 | 2004 |
| Mechanical stress as a function of temperature for aluminum alloy films DS Gardner, PA Flinn Journal of Applied Physics 67 (4), 1831-1844, 1990 | 150 | 1990 |
| Influence of line dimensions on the resistance of Cu interconnections DG Fen Chen Electron Device Letters 19 (12), 508-510, 1998 | 146* | 1998 |
| Integrated on-chip inductors using magnetic material DS Gardner, G Schrom, P Hazucha, F Paillet, T Karnik, S Borkar, ... Journal of Applied Physics 103 (7), 2008 | 139 | 2008 |
| QED: Quick error detection tests for effective post-silicon validation T Hong, Y Li, SB Park, D Mui, D Lin, ZA Kaleq, N Hakim, H Naeimi, ... 2010 IEEE International Test Conference, 1-10, 2010 | 127 | 2010 |
| Interconnection and electromigration scaling theory DS Gardner, JD Meindl, KC Saraswat IEEE Transactions on Electron Devices 34 (3), 633-643, 1987 | 122 | 1987 |
| A 100MHz eight-phase buck converter delivering 12A in 25mm2 using air-core inductors G Schrom, P Hazucha, F Paillet, DJ Rennie, ST Moon, DS Gardner, ... APEC 07-Twenty-Second Annual IEEE Applied Power Electronics Conference and …, 2007 | 117 | 2007 |
| High-frequency microinductors with amorphous magnetic ground planes AM Crawford, D Gardner, SX Wang IEEE transactions on magnetics 38 (5), 3168-3170, 2002 | 107 | 2002 |
| Design techniques for cross-layer resilience NP Carter, H Naeimi, DS Gardner 2010 Design, Automation & Test in Europe Conference & Exhibition (DATE 2010 …, 2010 | 98 | 2010 |
| Observations of electromigration induced void nucleation and growth in polycrystalline and near‐bamboo passivated Al lines T Marieb, P Flinn, JC Bravman, D Gardner, M Madden Journal of applied physics 78 (2), 1026-1032, 1995 | 95 | 1995 |
Gerhard SchromDirección de correo verificada de asu.edu
