| The influence of intrinsic strain softening on strain localization in polycarbonate: modeling and experimental validation LE Govaert, PHM Timmermans, WAM Brekelmans J. Eng. Mater. Technol. 122 (2), 177-185, 2000 | 302 | 2000 |
| Stretching-induced interconnect delamination in stretchable electronic circuits O Van Der Sluis, YY Hsu, PHM Timmermans, M Gonzalez, ... Journal of Physics D: Applied Physics 44 (3), 034008, 2010 | 77 | 2010 |
| Copper–rubber interface delamination in stretchable electronics JPM Hoefnagels, J Neggers, PHM Timmermans, O van Der Sluis, ... Scripta Materialia 63 (8), 875-878, 2010 | 59 | 2010 |
| Design and implementation of flexible and stretchable systems M Gonzalez, B Vandevelde, W Christiaens, YY Hsu, F Iker, F Bossuyt, ... Microelectronics Reliability 51 (6), 1069-1076, 2011 | 46 | 2011 |
| Mechanical failure analysis of thin film transistor devices on steel and polyimide substrates for flexible display applications Y Leterrier, A Pinyol, D Gilliéron, JAE Månson, PHM Timmermans, ... Engineering Fracture Mechanics 77 (4), 660-670, 2010 | 33 | 2010 |
| Effect of a hard coat layer on buckle delamination of thin ITO layers on a compliant elasto-plastic substrate: An experimental–numerical approach O Van der Sluis, AA Abdallah, PCP Bouten, PHM Timmermans, ... Engineering Fracture Mechanics 78 (6), 877-889, 2011 | 30 | 2011 |
| Numerical and experimental study of critical roof collapse conditions in soft lithography MMJ Decre, PHM Timmermans, O Van Der Sluis, R Schroeders Langmuir 21 (17), 7971-7978, 2005 | 24 | 2005 |
| Analysis of the three-dimensional delamination behavior of stretchable electronics applications O van der Sluis, PHM Timmermans, EJL Van der Zanden, ... EuroSimE 2009-10th International Conference on Thermal, Mechanical and Multi …, 2009 | 22 | 2009 |
| Numerical prediction of failure paths at a roughened metal/polymer interface SPM Noijen, O van der Sluis, PHM Timmermans, GQ Zhang Microelectronics Reliability 49 (9-11), 1315-1318, 2009 | 20 | 2009 |
| Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics O van der Sluis, RAB Engelen, PHM Timmermans, GQ Zhang Microelectronics Reliability 49 (8), 853-860, 2009 | 20 | 2009 |
| Thermo-mechanical analysis of flexible and stretchable systems M Gonzalez, B Vandevelde, W Christiaens, YY Hsu, F Iker, F Bossuyt, ... 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and …, 2010 | 17 | 2010 |
| A semi-analytic method for crack kinking analysis at isotropic bi-material interfaces SPM Noijen, O Van der Sluis, PHM Timmermans, GQ Zhang Engineering Fracture Mechanics 83, 8-25, 2012 | 16 | 2012 |
| Evaluation of a constitutive model for solid polymeric materials: model selection and parameter quantification PHM Timmermans | 16 | 1997 |
| Broadband ultrasound transducer S Shulepov, PHM Timmermans, P Dirksen US Patent 11,400,487, 2022 | 13 | 2022 |
| Correlation between electrical and mechanical properties of polymer composite IB Vendik, OG Vendik, VP Afanasjev, IM Sokolova, DA Chigirev, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1697-1702, 2011 | 11 | 2011 |
| Mechanics of tunnelling cracks in trilayer elastic materials in tension J Andersons, PHM Timmermans, J Modniks International journal of fracture 148, 233-241, 2007 | 9 | 2007 |
| An extensive investigation of the four point bending test for interface characterization SPM Noijen, O Van Der Sluis, PHM Timmermans 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012 | 8 | 2012 |
| Glass package for sealing a device, and system comprising glass package FAG Van Dijk, RHM Sanders, PHM Timmermans US Patent 9,028,932, 2015 | 6 | 2015 |
| On the Effect of Microscopic Surface Roughness on Macroscopic Polymer–Metal Adhesion O van der Sluis, SPM Noijen, PHM Timmermans Solid state lighting reliability: components to systems, 317-327, 2012 | 5 | 2012 |
| 23.1: Invited Paper: Models and Experiments of Mechanical Integrity for Flexible Displays Y Leterrier, A Pinyol, P Dumont, D Gilliéron, V Mewani, JA Månson, ... SID Symposium Digest of Technical Papers 39 (1), 310-313, 2008 | 5 | 2008 |
