| Strength development of solely ground granulated blast furnace slag geopolymers IH Aziz, MMAB Abdullah, MAAM Salleh, EA Azimi, J Chaiprapa, ... Construction and Building Materials 250, 118720, 2020 | 110 | 2020 |
| Mechanical properties of Sn–0.7 Cu/Si3N4 lead-free composite solder MAAM Salleh, AMM Al Bakri, MH Zan, F Somidin, NFM Alui, ZA Ahmad Materials Science and Engineering: A 556, 633-637, 2012 | 74 | 2012 |
| Rapid Cu6Sn5 growth at liquid Sn/solid Cu interfaces MAAM Salleh, SD McDonald, H Yasuda, A Sugiyama, K Nogita Scripta Materialia 100, 17-20, 2015 | 73 | 2015 |
| Solderability of Sn-0.7 Cu/Si3N4 lead-free composite solder on Cu-substrate MS MAA, AMM Al Bakri, H Kamarudin, M Bnhussain, F Somidin Physics Procedia 22, 299-304, 2011 | 71* | 2011 |
| Suppression of Cu6Sn5 in TiO2 reinforced solder joints after multiple reflow cycles MAAM Salleh, SD McDonald, CM Gourlay, H Yasuda, K Nogita Materials & Design 108, 418-428, 2016 | 68 | 2016 |
| Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0. 7Cu solders on Cu substrates MAAM Salleh, SD McDonald, K Nogita Journal of Materials Processing Technology 242, 235-245, 2017 | 65 | 2017 |
| Effect of TiO2 additions on Sn-0.7 Cu-0.05 Ni lead-free composite solder MII Ramli, N Saud, MAAM Salleh, MN Derman, RM Said Microelectronics Reliability 65, 255-264, 2016 | 59 | 2016 |
| Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process MAA Mohd Salleh, SD McDonald, CM Gourlay, SA Belyakov, H Yasuda, ... Journal of Electronic Materials 45, 154-163, 2016 | 58 | 2016 |
| In situ imaging of microstructure formation in electronic interconnections MAAM Salleh, CM Gourlay, JW Xian, SA Belyakov, H Yasuda, ... Scientific reports 7 (1), 40010, 2017 | 52 | 2017 |
| Strength development and elemental distribution of dolomite/fly ash geopolymer composite under elevated temperature EA Azimi, MMAB Abdullah, P Vizureanu, MAAM Salleh, AV Sandu, ... Materials 13 (4), 1015, 2020 | 44 | 2020 |
| Bonding strength characteristics of FA-based geopolymer paste as a repair material when applied on OPC substrate WW Ahmad Zailani, A Bouaissi, MMAB Abdullah, R Abd Razak, S Yoriya, ... Applied Sciences 10 (9), 3321, 2020 | 43 | 2020 |
| The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7 Cu-0.05 Ni alloys for high strength soldering MII Ramli, MAAM Salleh, H Yasuda, J Chaiprapa, K Nogita Materials & Design 186, 108281, 2020 | 43 | 2020 |
| Development of a microwave sintered TiO2 reinforced Sn–0.7 wt% Cu–0.05 wt% Ni alloy MAAM Salleh, SD McDonald, Y Terada, H Yasuda, K Nogita Materials & Design 82, 136-147, 2015 | 43 | 2015 |
| Strength of concrete based cement using recycle ceramic waste as aggregate AMM Al Bakri, MN Norazian, H Kamarudin, MAA Mohd Salleh, A Alida Advanced materials research 740, 734-738, 2013 | 41 | 2013 |
| Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain F Somidin, H Maeno, MAAM Salleh, XQ Tran, SD McDonald, ... Materials Characterization 138, 113-119, 2018 | 40 | 2018 |
| The influence of ageing on the stabilisation of interfacial (Cu, Ni) 6 (Sn, Zn) 5 and (Cu, Au, Ni) 6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints G Zeng, SD McDonald, D Mu, Y Terada, H Yasuda, Q Gu, MAAM Salleh, ... Journal of Alloys and Compounds 685, 471-482, 2016 | 40 | 2016 |
| Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7 Cu-0.05 Ni JW Xian, MAAM Salleh, SA Belyakov, TC Su, G Zeng, K Nogita, H Yasuda, ... Intermetallics 102, 34-45, 2018 | 33 | 2018 |
| Zn-Sn based high temperature solder-A short review SA Musa, MAA Mohd Salleh, N Saud Advanced Materials Research 795, 518-521, 2013 | 29 | 2013 |
| Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review MAA Mohd Salleh, K Nogita, S Mcdonald Applied Mechanics and Materials 421, 260-266, 2013 | 28 | 2013 |
| Wettability, Electrical and Mechanical Properties of 99.3Sn-0.7Cu/Si3N4 Novel Lead-Free Nanocomposite Solder MAA Mohd Salleh, MH Hazizi, ZA Ahmad, K Hussin, KR Ahmad Advanced Materials Research 277, 106-111, 2011 | 26 | 2011 |
