The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade RR Tummala, M Swaminathan, MM Tentzeris, J Laskar, GK Chang, ...
IEEE Transactions on Advanced Packaging 27 (2), 250-267, 2004
186 2004 Through-package-via formation and metallization of glass interposers V Sukumaran, Q Chen, F Liu, N Kumbhat, T Bandyopadhyay, H Chan, ...
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
143 2010 Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias V Sukumaran, T Bandyopadhyay, Q Chen, N Kumbhat, F Liu, R Pucha, ...
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 583-588, 2011
94 2011 Chip-last embedded interconnect structures F Liu, N Kumbhat, V Sundaram, RR Tummala
US Patent 8,536,695, 2013
77 2013 Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same V Sundaram, F Liu, R Tummala, V Sukumaran, V Sridharan, Q Chen
US Patent 9,275,934, 2016
74 2016 First demonstration of compact, ultra-thin low-pass and bandpass filters for 5G small-cell applications M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ...
IEEE Microwave and Wireless Components Letters 28 (12), 1110-1112, 2018
65 2018 Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV) V Sridharan, S Min, V Sundaram, V Sukumaran, S Hwang, H Chan, F Liu, ...
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
60 2010 45 degree polymer micromirror integration for board-level three-dimensional optical interconnects F Wang, F Liu, A Adibi
Optics express 17 (13), 10514-10521, 2009
58 2009 Reliability assessment of microvias in HDI printed circuit boards F Liu, J Lu, V Sundaram, D Sutter, G White, DF Baldwin, RR Tummala
IEEE Transactions on Components and Packaging Technologies 25 (2), 254-259, 2002
51 2002 Next-generation microvia and global wiring technologies for SOP V Sundaram, RR Tummala, F Liu, PA Kohl, J Li, SA Bidstrup-Allen, ...
IEEE Transactions on Advanced Packaging 27 (2), 315-325, 2004
49 2004 Low-cost and low-loss 3D silicon interposer for high bandwidth logic-to-memory interconnections without TSV in the logic IC V Sundaram, Q Chen, Y Suzuki, G Kumar, F Liu, R Tummala
2012 IEEE 62nd Electronic Components and Technology Conference, 292-297, 2012
44 2012 Single sensor that outputs narrowband multispectral images L Kong, D Yi, S Sprigle, F Wang, C Wang, F Liu, A Adibi, R Tummala
Journal of biomedical optics 15 (1), 010502-010502-3, 2010
42 2010 Design, Modeling, Fabrication and Characterization of 2–5- Redistribution Layer Traces by Advanced Semiadditive Processes on Low-Cost Panel-Based Glass … H Lu, R Furuya, BMD Sawyer, C Nair, F Liu, V Sundaram, RR Tummala
IEEE transactions on components, packaging and manufacturing technology 6 (6 …, 2016
40 2016 Micro impact characterisation of solder joint for drop impact application EH Wong, YW Mai, R Rajoo, KT Tsai, F Liu, SKW Seah, CL Yeh
56th Electronic Components and Technology Conference 2006, 8 pp., 2006
40 2006 Chip-to-chip optoelectronics SOP on organic boards or packages GK Chang, D Guidotti, F Liu, YJ Chang, Z Huang, V Sundaram, ...
IEEE Transactions on Advanced Packaging 27 (2), 386-397, 2004
40 2004 Chip-last embedded actives and passives in thin organic package for 1–110 GHz multi-band applications F Liu, V Sundaram, S Min, V Sridharan, H Chan, N Kumbhat, BW Lee, ...
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
36 2010 Through package via structures in panel-based silicon substrates and methods of making the same VV Sundaram, F Liu, RR Tummala, Q Chen
US Patent App. 13/448,064, 2012
35 2012 Miniaturized high-performance filters for 5G small-cell applications M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1068-1075, 2018
33 2018 Design of embedded high Q-inductors in MCM-L technology S Dalmia, W Kim, SH Min, M Swaminathan, V Sundaraman, F Liu, ...
2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No. 01CH37157 …, 2001
33 2001 2.5 D glass panel embedded (GPE) packages with better I/O density, performance, cost and reliability than current silicon interposers and high-density fan-out packages S Ravichandran, S Yamada, G Park, HW Chen, T Shi, C Buch, F Liu, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 625-630, 2018
32 2018