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Co-authors
Nick FangProfessor of Mechanical Engineering, MIT (current); previous: UCLA, UIUCVerified email at mit.edu
Che Ting ChanProfessor of Physics, Hong Kong University of Science and TechnologyVerified email at ust.hk
Anil KumarUniversity of Illinois at Urbana-ChampaignVerified email at illinois.edu
yanxia cuiProfessor of Optical Engineering, Taiyuan University of TechnologyVerified email at tyut.edu.cn
Jun XUResearch Scientist of Mechanical Engineering, MITVerified email at mit.edu
Sailing HeProfessor, KTH, ZJUVerified email at jorcep.org
Anshuman KumarAssistant Professor, Indian Institute of Technology BombayVerified email at alum.mit.edu
Siu Fung YuThe Hong Kong Polytechnic UniversityVerified email at polyu.edu.hk
Tony LowU of Minnesota, IBM Research, Columbia U, Purdue U, National U SingaporeVerified email at us.ibm.com
Yong-Liang ZhangInstitute of Semiconductors, Chinese Academy of ScienceVerified email at mail.ipc.ac.cn
Meng XIAOProfessor of Physics, Wuhan UniversityVerified email at whu.edu.cn
Phaedon AvourisIBM Fellow, Manager Nanoscience and Nanotechnology, IBM T.J. Watson Research CenterVerified email at us.ibm.com
Shu Ping LauThe Hong Kong Polytechnic University and Nanyang Technological UniversityVerified email at polyu.edu.hk
Brian J. RoxworthyUS Naval Research LaboratoryVerified email at nrl.navy.mil
Jin WangSoutheast UniversityVerified email at seu.edu.cn
Jack NgSouthern University of Science and TechnologyVerified email at sustech.edu.cn
Jensen LiThe Hong Kong University of Science and TechnologyVerified email at ust.hk
Dr. Pratik ChaturvediIntel CorporationVerified email at intel.com
Andrei NemilentsauUniversity of Minnesota Twin CitiesVerified email at umn.edu
George HansonProfessor of Electrical Engineering, University of Wisconsin-MilwaukeeVerified email at uwm.edu
Kin Hung Fung
Assistant Professor, Dept of Applied Physics, The Hong Kong Polytechnic University
Verified email at polyu.edu.hk - Homepage