Bismarck Luiz Silva
TítuloCitado porAño
Thermal parameters, microstructure, and mechanical properties of directionally solidified Sn-0.7 wt.% Cu solder alloys containing 0 ppm to 1000 ppm Ni
BL Silva, N Cheung, A Garcia, JE Spinelli
Journal of electronic materials 42 (1), 179-191, 2013
372013
Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy
BL Silva, G Reinhart, H Nguyen-Thi, N Mangelinck-Noël, A Garcia, ...
Materials Characterization 107, 43-53, 2015
322015
Sn–0.7 wt% Cu–(xNi) alloys: Microstructure–mechanical properties correlations with solder/substrate interfacial heat transfer coefficient
BL Silva, N Cheung, A Garcia, JE Spinelli
Journal of Alloys and Compounds 632, 274-285, 2015
312015
Microstructure, phases morphologies and hardness of a Bi–Ag eutectic alloy for high temperature soldering applications
JE Spinelli, BL Silva, A Garcia
Materials & Design 58, 482-490, 2014
312014
The effects of microstructure and intermetallic phases of directionally solidified Al–Fe alloys on microhardness
BL Silva, A Garcia, JE Spinelli
Materials Letters 89, 291-295, 2012
312012
Evaluation of solder/substrate thermal conductance and wetting angle of Sn–0.7 wt% Cu–(0–0.1 wt% Ni) solder alloys
BL Silva, N Cheung, A Garcia, JE Spinelli
Materials Letters 142, 163-167, 2015
292015
Assessment of tertiary dendritic growth and its effects on mechanical properties of directionally solidified Sn-0.7 Cu-xAg solder alloys
JE Spinelli, BL Silva, A Garcia
Journal of electronic materials 43 (5), 1347-1361, 2014
252014
Complex eutectic growth and Bi precipitation in ternary Sn-Bi-Cu and Sn-Bi-Ag alloys
BL Silva, A Garcia, JE Spinelli
Journal of Alloys and Compounds 691, 600-605, 2017
242017
Production and characterization of a milk-clotting protease produced in submerged fermentation by the thermophilic fungus Thermomucor indicae-seudaticae N31
BL Silva, FM Geraldes, CS Murari, E Gomes, R Da-Silva
Applied biochemistry and biotechnology 172 (4), 1999-2011, 2014
242014
Cooling thermal parameters and microstructure features of directionally solidified ternary Sn–Bi–(Cu, Ag) solder alloys
BL Silva, A Garcia, JE Spinelli
Materials Characterization 114, 30-42, 2016
232016
Correlation between dendrite arm spacing and microhardness during unsteady-state directional solidification of Al–Ni alloys
BL Silva, IJC Araujo, WS Silva, PR Goulart, A Garcia, JE Spinelli
Philosophical magazine letters 91 (5), 337-343, 2011
182011
Cu and Ag additions affecting the solidification microstructure and tensile properties of Sn-Bi lead-free solder alloys
BL Silva, MGC Xavier, A Garcia, JE Spinelli
Materials Science and Engineering: A 705, 325-334, 2017
162017
The use of a directional solidification technique to investigate the interrelationship of thermal parameters, microstructure and microhardness of Bi–Ag solder alloys
JE Spinelli, BL Silva, N Cheung, A Garcia
Materials characterization 96, 115-125, 2014
152014
A comparative analysis of microstructural features, tensile properties and wettability of hypoperitectic and peritectic Sn-Sb solder alloys
M Dias, TA Costa, BL Silva, JE Spinelli, N Cheung, A Garcia
Microelectronics reliability 81, 150-158, 2018
132018
Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys
BL Silva, F Bertelli, MV Canté, JE Spinelli, N Cheung, A Garcia
Journal of Materials Science: Materials in Electronics, 1-10, 2016
132016
Effects of solidification thermal parameters on microstructure and mechanical properties of Sn-Bi solder alloys
BL Silva, VCE da Silva, A Garcia, JE Spinelli
Journal of Electronic Materials 46 (3), 1754-1769, 2017
122017
An alternative thermal approach to evaluate the wettability of solder alloys
WLR Santos, BL Silva, F Bertelli, JE Spinelli, N Cheung, A Garcia
Applied Thermal Engineering 107, 431-440, 2016
122016
Directional solidification of a Sn-0.2 Ni solder alloy in water-cooled copper and steel molds: Related effects on the matrix micromorphology, nature of intermetallics and …
MGC Xavier, CB Cruz, R Kakitani, BL Silva, A Garcia, N Cheung, ...
Journal of Alloys and Compounds 723, 1039-1052, 2017
102017
Dendritic growth, solidification thermal parameters, and Mg content affecting the tensile properties of Al-Mg-1.5 Wt Pct Fe alloys
LF Gomes, BL Silva, A Garcia, JE Spinelli
Metallurgical and Materials Transactions A 48 (4), 1841-1855, 2017
82017
The roles of dendritic spacings and Ag3Sn intermetallics on hardness of the SAC307 solder alloy
BL Silva, A Garcia, JE Spinelli
Microelectronics Reliability 54 (12), 2929-2934, 2014
82014
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