GQ Lu or Guo-Quan Lu or G-Q Lu
Citado por
Citado por
Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material
JG Bai, ZZ Zhang, JN Calata, GQ Lu
IEEE Transactions on components and packaging technologies 29 (3), 589-593, 2006
Low-temperature sintering with nano-silver paste in die-attached interconnection
T Wang, X Chen, GQ Lu, GY Lei
journal of electronic materials 36 (10), 1333-1340, 2007
Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area Chips
TG Lei, JN Calata, GQ Lu, X Chen, S Luo
IEEE Transactions on Components and Packaging Technologies 33 (1), 98-104, 2009
Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
Z Zhang, GQ Lu
IEEE Transactions on electronics packaging manufacturing 25 (4), 279-283, 2002
Thermomechanical reliability of low-temperature sintered silver die attached SiC power device assembly
JG Bai, GQ Lu
IEEE Transactions on device and materials reliability 6 (3), 436-441, 2006
The activation strain tensor: nonhydrostatic stress effects on crystal-growth kinetics
MJ Aziz, PC Sabin, GQ Lu
Physical Review B 44 (18), 9812, 1991
Pressure‐enhanced crystallization kinetics of amorphous Si and Ge: Implications for point‐defect mechanisms
GQ Lu, E Nygren, MJ Aziz
Journal of applied physics 70 (10), 5323-5345, 1991
High-temperature operation of SiC power devices by low-temperature sintered silver die-attachment
JG Bai, J Yin, Z Zhang, GQ Lu, JD van Wyk
IEEE transactions on advanced packaging 30 (3), 506-510, 2007
Processing and characterization of nanosilver pastes for die-attaching SiC devices
JG Bai, JN Calata, GQ Lu
IEEE Transactions on electronics packaging manufacturing 30 (4), 241-245, 2007
Technology trends toward a system-in-a-module in power electronics
FC Lee, JD van Wyk, D Boroyevich, GQ Lu, Z Liang, P Barbosa
IEEE Circuits and systems magazine 2 (4), 4-22, 2002
Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment
D Yu, X Chen, G Chen, G Lu, Z Wang
Materials & Design 30 (10), 4574-4579, 2009
Circumferential-mode, quasi-ring-type, magnetoelectric laminate composite—a highly sensitive electric current and∕ or vortex magnetic field sensor
S Dong, JG Bai, J Zhai, JF Li, GQ Lu, D Viehland, S Zhang, TR Shrout
Applied Physics Letters 86 (18), 182506, 2005
Three-dimensional packaging for power semiconductor devices and modules
JN Calata, JG Bai, X Liu, S Wen, GQ Lu
IEEE transactions on advanced packaging 28 (3), 404-412, 2005
Characterization of lead-free solder and sintered nano-silver die-attach layers using thermal impedance
X Cao, T Wang, KDT Ngo, GQ Lu
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (4 …, 2011
A novel high-temperature planar package for SiC multichip phase-leg power module
P Ning, TG Lei, F Wang, GQ Lu, KDT Ngo, K Rajashekara
IEEE Transactions on power Electronics 25 (8), 2059-2067, 2010
An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures
S Haque, K Xing, RL Lin, CTA Suchicital, GQ Lu, DJ Nelson, D Borojevic, ...
IEEE Transactions on Advanced Packaging 22 (2), 136-144, 1999
Effect of mismatched sintering kinetics on camber in a low‐temperature cofired ceramic package
GQ Lu, RC Sutterlin, TK Gupta
Journal of the American Ceramic Society 76 (8), 1907-1914, 1993
A lead-free, low-temperature sintering die-attach technique for high-performance and high-temperature packaging
GQ Lu, JN Calata, Z Zhang, JG Bai
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem …, 2004
In vitro photothermal study of gold nanoshells functionalized with small targeting peptides to liver cancer cells
SY Liu, ZS Liang, F Gao, SF Luo, GQ Lu
Journal of Materials Science: Materials in Medicine 21 (2), 665-674, 2010
Effects of solder joint shape and height on thermal fatigue lifetime
X Liu, GQ Lu
IEEE transactions on components and packaging technologies 26 (2), 455-465, 2003
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Artículos 1–20