Get my own profile
Co-authors
Philip EisenlohrAssociate Professor, Chemical Engineering and Materials Science, Michigan State UniversityVerified email at egr.msu.edu
Tae-Kyu LeeCisco SystemsVerified email at cisco.com
S L SemiatinSenior Scientist (emeritus), Materials Processing/Processing Science, Air Force Research LaboratoryVerified email at us.af.mil
Amiya MukherjeeProfessor of Materials Science and Engineering, University of California , Davis, CAVerified email at ucdavis.edu
Bite ZhouFailure Analysis R&D Engineer, Intel CorporationVerified email at intel.com
Leyun WangShanghai Jiao Tong UniversityVerified email at sjtu.edu.cn
Dierk RaabeMax-Planck-Institut für Eisenforschung GmbHVerified email at mpie.de
Amir ZamiriR&D, Medtronic, Inc.Verified email at medtronic.com
Payam DarbandiPhD, Ford Motor companyVerified email at ford.com
Rajiv S. MishraProfessor of Materials Science and Engineering, University of North TexasVerified email at unt.edu
Hongmei LiIntel Corp.Verified email at intel.com
Fu GuoProfessor, College of Materials Science and Engineering, Beijing University of TechnologyVerified email at bjut.edu.cn
David MercierSr Development manager - PhDVerified email at ansys.com
Quan (Jason) ZhouHitachi America, Ltd.Verified email at hal.hitachi.com
Deepak Kumar, Ph.D.Senior Materials Scientist/Engineer - at Baker HughesVerified email at bakerhughes.com
Denny Dharmawan TjahjantoSenior Scientist at ABB Corporate ResearchVerified email at se.abb.com
A. J. BeaudoinUniversity of Illinois at Urbana-ChampaignVerified email at illinois.edu
Claudio ZambaldiScientist at Max-Planck-Institut für EisenforschungVerified email at mpie.de
Karl HartwigTexas A&M UniversityVerified email at tamu.edu
Peter KeneseiAdvanced Photon Source, Argonne National Laboratory, Illinois, USAVerified email at anl.gov
Thomas R. Bieler
Verified email at egr.msu.edu