On instability-induced debond initiation in thin film systems S Goyal, K Srinivasan, G Subbarayan, T Siegmund Engineering Fracture Mechanics 77 (8), 1298-1313, 2010 | 30 | 2010 |
Compensation of overlay errors due to mask bending and non-flatness for EUV masks M Chandhok, S Goyal, S Carson, SJ Park, G Zhang, AM Myers, ... Alternative Lithographic Technologies 7271, 129-140, 2009 | 25 | 2009 |
A non-contact, thermally-driven buckling delamination test to measure interfacial fracture toughness of thin film systems S Goyal, K Srinivasan, G Subbarayan, T Siegmund Thin Solid Films 518 (8), 2056-2064, 2010 | 22 | 2010 |
Application of coreless substrate to package on package architectures R Nickerson, R Olmedo, R Mortensen, CK Chee, S Goyal, AL Low, ... 2012 IEEE 62nd Electronic Components and Technology Conference, 1368-1371, 2012 | 14 | 2012 |
Design and application of a nonlinear energy sink to mitigate vibrations of an air spring supported slab S Goyal, TM Whalen International Design Engineering Technical Conferences and Computers and …, 2005 | 10 | 2005 |
The effect of corner glue on BGA package temperature cycling performance: A modeling study M Pei, R Han, Y Ge, S Goyal, V Rajarathinam, M Mukadam 2013 IEEE 63rd Electronic Components and Technology Conference, 1494-1499, 2013 | 7 | 2013 |
Event-based use conditions method for thermo-mechanical reliability risk assessment I Sauciuc, S Goyal, M Pei, T Harirchian, M Tse, R Kwasnick, S Tripathi, ... Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 5 | 2014 |
Active suspensions for tracked Vehicles YG Srinivasa, S Goyal, PR Sanketi Proceedings of the Tenth International Congress on Sound and Vibration …, 2003 | 5 | 2003 |
Voltage in-situ electrical metrology for test-to-failure BGA component shock margin assessment R Uppalapati, S Goyal, M Williams, S Parupalli 2012 IEEE 62nd Electronic Components and Technology Conference, 981-989, 2012 | 4 | 2012 |
Estimating the Yield Strength of Thin Metal Films Through Elastic–Plastic Buckling-Induced Debonding S Goyal, K Srinivasan, G Subbarayan, T Siegmund IEEE Transactions on Device and Materials Reliability 11 (2), 358-361, 2011 | 4 | 2011 |
Buckling, wrinkling and debonding in thin film systems S Goyal, K Srinivasan, G Subbarayan, T Siegmund 2010 IEEE International Reliability Physics Symposium, 430-439, 2010 | 4 | 2010 |
Thermally induced wrinkling in thin-film stacks on patterned substrates K Srinivasan, S Goyal, T Siegmund, G Subbarayan, Q Lin IBM Journal of Research and Development 53 (3), 12: 1-12: 10, 2009 | 4 | 2009 |
Mechanics of thermally driven buckling-induced debonding in thin films S Goyal | 1 | 2009 |