Ageing and failure modes of IGBT modules in high-temperature power cycling V Smet, F Forest, JJ Huselstein, F Richardeau, Z Khatir, S Lefebvre, ...
IEEE transactions on industrial electronics 58 (10), 4931-4941, 2011
655 2011 A review of SiC power module packaging technologies: Challenges, advances, and emerging issues H Lee, V Smet, R Tummala
IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 239-255, 2019
292 2019 Evaluation of Monitoring as a Real-Time Method to Estimate Aging of Bond Wire-IGBT Modules Stressed by Power Cycling V Smet, F Forest, JJ Huselstein, A Rashed, F Richardeau
IEEE Transactions on Industrial Electronics 60 (7), 2760-2770, 2012
245 2012 Review of thermal packaging technologies for automotive power electronics for traction purposes J Broughton, V Smet, RR Tummala, YK Joshi
Journal of Electronic Packaging 140 (4), 040801, 2018
121 2018 Design and comparison of inductors and intercell transformers for filtering of PWM inverter output FÇ Forest, E LabourÉ, TA Meynard, V Smet
IEEE Transactions on Power Electronics 24 (3), 812-821, 2009
115 2009 A review of nanoporous metals in interconnects K Mohan, N Shahane, R Liu, V Smet, A Antoniou
Jom 70, 2192-2204, 2018
47 2018 First demonstration of panel glass fan-out (GFO) packages for high I/O density and high frequency multi-chip integration T Shi, C Buch, V Smet, Y Sato, L Parthier, F Wei, C Lee, V Sundaram, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 41-46, 2017
47 2017 Ultrathin antenna-integrated glass-based millimeter-wave package with through-glass vias AO Watanabe, TH Lin, M Ali, Y Wang, V Smet, PM Raj, MM Tentzeris, ...
IEEE Transactions on Microwave Theory and Techniques 68 (12), 5082-5092, 2020
46 2020 Design and demonstration of a 2.5-D glass interposer BGA package for high bandwidth and low cost BMD Sawyer, Y Suzuki, R Furuya, C Nair, TC Huang, V Smet, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (4 …, 2017
37 2017 Aging and failure modes of IGBT power modules undergoing power cycling in high temperature environments V Smet
Montpellier 2, 2010
34 2010 2.5 D glass panel embedded (GPE) packages with better I/O density, performance, cost and reliability than current silicon interposers and high-density fan-out packages S Ravichandran, S Yamada, G Park, HW Chen, T Shi, C Buch, F Liu, ...
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 625-630, 2018
32 2018 Board-level thermal cycling and drop-test reliability of large, ultrathin glass BGA packages for smart mobile applications B Singh, G Menezes, S McCann, V Jayaram, U Ray, V Sundaram, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (5 …, 2017
32 2017 Low cost, high performance, and high reliability 2.5 D silicon interposer V Sundaram, Q Chen, T Wang, H Lu, Y Suzuki, V Smet, M Kobayashi, ...
2013 IEEE 63rd Electronic Components and Technology Conference, 342-347, 2013
26 2013 Design of intercell transformers for high-power multicell interleaved flyback converter F Forest, E Labouré, B Gélis, V Smet, TA Meynard, JJ Huselstein
IEEE Transactions on Power Electronics 24 (3), 580-591, 2009
25 2009 Low-temperature, organics-free sintering of nanoporous copper for reliable, high-temperature and high-power die-attach interconnections K Mohan, N Shahane, PM Raj, A Antoniou, V Smet, R Tummala
2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 3083-3090, 2017
24 2017 New structure of microelectronic packages with edge protection by coating V Sundaram, V Smet, RR Tummala
US Patent App. 14/919,696, 2016
22 2016 Modeling, design, fabrication and characterization of first large 2.5 D glass interposer as a superior alternative to silicon and organic interposers at 50 micron bump pitch B Sawyer, H Lu, Y Suzuki, Y Takagi, M Kobayashi, V Smet, T Sakai, ...
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 742-747, 2014
21 2014 Heterogeneous integration for artificial intelligence: Challenges and opportunities S Mukhopadhyay, Y Long, B Mudassar, CS Nair, BH DeProspo, ...
IBM Journal of Research and Development 63 (6), 4: 1-4: 1, 2019
20 2019 Design and demonstration of Glass Panel Embedding for 3D System Packages for heterogeneous integration applications S Ravichandran, S Yamada, T Ogawa, T Shi, F Liu, V Smet, V Sundaram, ...
Journal of Microelectronics and Electronic Packaging 16 (3), 124-135, 2019
18 2019 Interconnect assemblies and methods of making and using same R Tummala, V Sundaram, MR Pulugurtha, T Wang, V Smet
US Patent App. 14/160,136, 2014
15 2014