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Xavier F Brun
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Cited by
Year
Analysis of stresses and breakage of crystalline silicon wafers during handling and transport
XF Brun, SN Melkote
Solar energy materials and solar cells 93 (8), 1238-1247, 2009
1652009
Modeling and prediction of the flow, pressure, and holding force generated by a Bernoulli handling device
XF Brun, SN Melkote
532009
Evaluation of handling stresses applied to EFG silicon wafer using a Bernoulli Gripper
XF Brun, SN Melkote
2006 IEEE 4th World Conference on Photovoltaic Energy Conference 2, 1346-1349, 2006
252006
A novel design of temporary bond debond adhesive technology for wafer-level assembly
D Xu, HW Wang, J Patel, XF Brun, K Hirota, E Capsuto, H Kato, M Sugo
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 68-74, 2020
162020
Effect of substrate flexibility on the pressure distribution and lifting force generated by a Bernoulli gripper
X Brun, SN Melkote
162012
Electrostatic discharge compliant patterned adhesive tape
DD Xu, W Feng, X Brun, S Iyer, A Reichman
US Patent App. 13/993,339, 2013
142013
Analysis of handling stresses and breakage of thin crystalline silicon wafers
XF Brun
Georgia Institute of Technology, 2008
132008
Enabling next generation 3D heterogeneous integration architectures on intel process
A Elsherbini, K Jun, S Liff, T Talukdar, J Bielefeld, W Li, R Vreeland, ...
2022 International Electron Devices Meeting (IEDM), 27.3. 1-27.3. 4, 2022
102022
Low temperature Direct Bonding of SiN and SiO interfaces for packaging applications
XF Brun, J Burggraf, B Ruxandra-Aida, C Mühlstätter
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 182-187, 2020
102020
Modeling and experimental verification of partial slip for multiple frictional contact problems
XF Brun, SN Melkote
Wear 265 (1-2), 34-41, 2008
102008
Modeling and prediction of the flow, pressure and holding force generated by a Bernoulli Handling Device
XF Brun, SN Melkote
International Manufacturing Science and Engineering Conference 48524, 351-358, 2008
102008
Separation apparatus, separation system, and separation method
O Hirakawa, M Honda, XF Brun, CW Singleton Jr
US Patent 9,827,756, 2017
82017
Thermal History Index as a bulk quality indicator for Czochralski solar wafers
J Veirman, B Martel, E Letty, R Peyronnet, G Raymond, M Cascant, ...
Solar Energy Materials and Solar Cells 158, 55-59, 2016
72016
Microelectronic component having molded regions with through-mold vias
S Ganesan, R Viswanath, XF Brun, TA Ibrahim, JM Gamba, M Dubey, ...
US Patent 11,302,643, 2022
62022
Heat assisted handling of highly warped substrates post temporary bonding
XF Brun, H Ma
US Patent 9,437,468, 2016
62016
Separation apparatus, separation system, and separation method
O Hirakawa, M Honda, A Fukutomi, T Tamura, J Harada, N Kazutaka, ...
US Patent 10,071,544, 2018
52018
Peeling device, peeling system and peeling method
O Hirakawa, N Yoshitaka, M Honda, XF Brun, CW Singleton Jr
US Patent 9,919,509, 2018
52018
Patterned adhesive tape for backgrinding processes
D Xu, XF Brun
US Patent App. 13/992,511, 2013
52013
Separation method, separation apparatus, and separation system
O Hirakawa, M Honda, XF Brun, CW Singleton Jr
US Patent 9,956,755, 2018
42018
Modular technique for die-level liquid cooling
XF Brun, CM Jha
US Patent App. 16/810,341, 2021
32021
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