Ryan Cochran
Ryan Cochran
Staff Engineer at Qualcomm
Verified email at alumni.brown.edu
Title
Cited by
Cited by
Year
Pack & Cap: adaptive DVFS and thread packing under power caps
R Cochran, C Hankendi, AK Coskun, S Reda
Proceedings of the 44th annual IEEE/ACM international symposium on …, 2011
3142011
Thermal monitoring of real processors: Techniques for sensor allocation and full characterization
AN Nowroz, R Cochran, S Reda
Proceedings of the 47th Design Automation Conference, 56-61, 2010
902010
Consistent runtime thermal prediction and control through workload phase detection
R Cochran, S Reda
Proceedings of the 47th Design Automation Conference, 62-67, 2010
832010
Improved thermal tracking for processors using hard and soft sensor allocation techniques
S Reda, RJ Cochran, AN Nowroz
Computers, IEEE Transactions on 60 (6), 841-851, 2011
802011
Spectral techniques for high-resolution thermal characterization with limited sensor data
R Cochran, S Reda
Design Automation Conference, 2009. DAC'09. 46th ACM/IEEE, 478-483, 2009
712009
Adaptive Power Capping for Servers with Multi-threaded Workloads
S Reda, R Cochran, A Coskun
IEEE, 2012
632012
Post-silicon power characterization using thermal infrared emissions
R Cochran, AN Nowroz, S Reda
Proceedings of the 16th ACM/IEEE international symposium on Low power …, 2010
492010
Identifying the optimal energy-efficient operating points of parallel workloads
R Cochran, C Hankendi, A Coskun, S Reda
Computer-Aided Design (ICCAD), 2011 IEEE/ACM International Conference on …, 2011
392011
Thermal prediction and adaptive control through workload phase detection
R Cochran, S Reda
ACM Transactions on Design Automation of Electronic Systems (TODAES) 18 (1), 7, 2012
382012
Techniques for Adaptive Power and Thermal Sensing and Management of Multi-core Processors
R Cochran
Brown University, 2013
82013
Post-silicon power mapping techniques for integrated circuits
S Reda, AN Nowroz, R Cochran, S Angelevski
INTEGRATION, the VLSI journal 46 (1), 69-79, 2013
82013
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