Felipe Bertelli
Felipe Bertelli
Professor no Programa de Pós-Graduação em Engenharia Mecânica - Unisanta
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Characterization of dendritic microstructure, intermetallic phases, and hardness of directionally solidified Al-Mg and Al-Mg-Si alloys
C Brito, TA Costa, TA Vida, F Bertelli, N Cheung, JE Spinelli, A Garcia
Metallurgical and Materials Transactions A 46 (8), 3342-3355, 2015
Cooling thermal parameters, microstructure, segregation and hardness in directionally solidified Al–Sn-(Si; Cu) alloys
F Bertelli, C Brito, IL Ferreira, G Reinhart, H Nguyen-Thi, ...
Materials & Design 72, 31-42, 2015
Laser remelting of Al–1.5 wt% Fe alloy surfaces: numerical and experimental analyses
F Bertelli, ES Meza, PR Goulart, N Cheung, R Riva, A Garcia
Optics and Lasers in Engineering 49 (4), 490-497, 2011
Microstructure, tensile properties and wear resistance correlations on directionally solidified Al-Sn-(Cu; Si) alloys
F Bertelli, ES Freitas, N Cheung, MA Arenas, A Conde, J de Damborenea, ...
Journal of Alloys and Compounds 695, 3621-3631, 2017
Microstructural development of hypoeutectic Zn–(10–40) wt% Sn solder alloys and impacts of interphase spacing and macrosegregation pattern on hardness
WLR Santos, C Brito, F Bertelli, JE Spinelli, A Garcia
Journal of Alloys and Compounds 647, 989-996, 2015
The effect of the growth rate on microsegregation: Experimental investigation in hypoeutectic Al–Fe and Al–Cu alloys directionally solidified
ES Meza, F Bertelli, PR Goulart, N Cheung, A Garcia
Journal of Alloys and Compounds 561, 193-200, 2013
Solder/substrate interfacial thermal conductance and wetting angles of Bi–Ag solder alloys
BL Silva, F Bertelli, MV Canté, JE Spinelli, N Cheung, A Garcia
Journal of Materials Science: Materials in Electronics 27 (2), 1994-2003, 2016
Inward solidification of cylinders: Reversal in the growth rate and microstructure evolution
F Bertelli, N Cheung, A Garcia
Applied thermal engineering 61 (2), 577-582, 2013
An alternative thermal approach to evaluate the wettability of solder alloys
WLR Santos, BL Silva, F Bertelli, JE Spinelli, N Cheung, A Garcia
Applied Thermal Engineering 107, 431-440, 2016
Cellular growth of single-phase Zn–Ag alloys unidirectionally solidified
M Dias, C Brito, F Bertelli, A Garcia
Materials Chemistry and Physics 143 (3), 895-899, 2014
An effective inverse heat transfer procedure based on evolutionary algorithms to determine cooling conditions of a steel continuous casting machine
F Bertelli, CH Silva-Santos, DJ Bezerra, N Cheung, A Garcia
Materials and Manufacturing Processes 30 (4), 414-424, 2015
Inward and outward solidification of cylindrical castings: The role of the metal/mold heat transfer coefficient
F Bertelli, C Brito, ES Meza, N Cheung, A Garcia
Materials Chemistry and Physics 136 (2-3), 545-554, 2012
Numerical and experimental modelling of two-dimensional unsteady heat transfer during inward solidification of square billets
F Bertelli, JD Faria, PR Goulart, C Brito, N Cheung, A Garcia
Applied Thermal Engineering 96, 454-462, 2016
An artificial immune system algorithm applied to the solution of an inverse problem in unsteady inward solidification
CH Silva-Santos, PR Goulart, F Bertelli, A Garcia, N Cheung
Advances in Engineering Software 121, 178-187, 2018
Interconnection of thermal parameters, microstructure, macrosegregation and microhardness of unidirectionally solidified Zn-rich Zn–Ag peritectic alloys
M Dias, C Brito, F Bertelli, OL Rocha, A Garcia
Materials & Design 63, 848-855, 2014
Evaluation of thermophysical properties of Al–Sn–Si alloys based on computational thermodynamics and validation by numerical and experimental simulation of solidification
F Bertelli, N Cheung, IL Ferreira, A Garcia
The journal of chemical thermodynamics 98, 9-20, 2016
Modelagem numérica e análise experimental de parâmetros térmicos e microestruturais na solidificação radial de ligas binárias
F Bertelli
[sn], 2012
Progression of plastic strain on heavy-haul railway rail under random pure rolling and its influence on crack initiation
T Reis, E de Abreu Lima, F Bertelli, AA dos Santos Junior
Advances in Engineering Software 124, 10-21, 2018
The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates
JP Curtulo, M Dias, F Bertelli, BL Silva, JE Spinelli, A Garcia, N Cheung
Journal of Manufacturing Processes 48, 164-173, 2019
Cellular microstructure and mechanical properties of a directionally solidified Al-1.0 wt% Fe alloy
PR Goulart, JE Spinelli, F Bertelli, WRR Osório, N Cheung, A Garcia
Materials Science Forum 636, 564-570, 2010
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